CB_w 150[mm] Circuit board width CB_l 150[mm] Circuit board length CB_t 3[mm] Circuit board thickness IC_1_w 50[mm] IC 1 width IC_1_l 50[mm] IC 1 length IC_1_t 3[mm] IC 1 thickness IC_2_w 15[mm] ICs 2 width IC_2_l 20[mm] ICs 2 length IC_2_t 3[mm] ICs 2 thickness IC_3_w 15[mm] ICs 3 width IC_3_l 40[mm] ICs 3 length IC_3_t 3[mm] IC2 3 thickness p1 20[W] Power dissipated by IC 1 p2 1[W] Power dissipated by ICs 2 p3 2[W] Power dissipated by ICs 3 V1 IC_1_l*IC_1_w*IC_1_t Volume of IC 1 V2 IC_2_l*IC_2_w*IC_2_t Volume of ICs 2 V3 IC_3_l*IC_3_w*IC_3_t Volume of ICs 3 q1 p1/V1 Volumetric heat source of IC 1 q2 p2/V2 Volumetric heat source of ICs 2 q3 p3/V3 Volumetric heat source of ICs 3 h_coeff 20[W/(m^2*K)] Heat exchange coefficient T0 273.15[K] Air flow temperature i_radius 5[mm] Inner radius t_h 30[mm] Heat sink tube height o_radius 25[mm] Outer radius Air_sp 3[mm] Air spacing between sink fins