Die Applications Galerie bietet COMSOL Multiphysics® Tutorial- und Demo-Application-Dateien, die für die Bereiche Elektrik, Struktur, Akustik, Fluid, Wärme und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorialmodell oder die Demo-Application-Datei und die dazugehörigen Anleitungen herunterladen.

Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.

Structural Mechanics Modulex

Topology Optimization of Loaded Knee Structure with a Maximum Stress Constraint

This model demonstrates 2D topology optimization for the problem of minimum mass subject to a compliance constraint and a stress constraint. The stress constraint is implemented with a P-norm global aggregation function. The stress input to this is interpolated differently than the Young ... Mehr lesen

Absorptive Muffler with Shells

This model describes the pressure wave propagation in a muffler for an internal combustion engine. The purpose of the model is to show how to analyze both inductive and resistive damping in pressure acoustics as well as coupling the fluid to the surrounding elastic shell structure of the ... Mehr lesen

Preconditioning (PRE) of Surface Mount Devices (SMDs) for testing

Prior to the reliability testing, surface mount devices (SMDs) are required to go through a preconditioning process, which represents the effects of storage and the typical reflow operation in the following board assembly process. During the preconditioning process, test samples usually ... Mehr lesen

Vibrating Micromirror with Viscous and Thermal Damping: Transient Behavior

Micromirrors are used in certain MEMS devices to control optic elements. This example model illustrates a mirror that is initially actuated for a short time and then exhibits damped vibrations. It simulates a vibrating micromirror surrounded by air and uses the Thermoviscous Acoustics, ... Mehr lesen

Four-Point Bending Test of an IGBT Module

The four-point bending test is a conventional test method used to test the mechanical properties of materials subjected to bending. It is one of the main reliability tests for semiconductors. This model demonstrates the stress analysis of an IGBT module subjected to a four-point bending ... Mehr lesen

Kirsch Infinite Plate Problem

This model describes a static stress analysis to obtain the stress distribution in the vicinity of a small hole in an infinite plate. The model is a classic benchmark and is described in Mechanics of Material, by D. Roylance. The stress level is then compared with the theoretical values. Mehr lesen

Pinched Hemispherical Shell

This example studies the deformation of a hemispherical shell, where the loads cause significant geometric nonlinearity. The maximum deflections are more than two magnitudes larger than the thickness of the shell. The problem is a standard benchmark, used for testing shell formulations ... Mehr lesen

Acoustic-Structure Interaction with Frequency Domain, Modal Solver

For models with acoustic-structure couplings it is necessary to calculate the left eigenvectors to use the Frequency Domain, Modal solver. The model shows the necessary changes to the default settings of the eigenfrequency solver. Mehr lesen

Beam Section Calculator

This app demonstrates: Light theme This app allows you to evaluate cross-section data for a wide range of American and European standard beams. Given a set of forces and moments acting on the section, you can also compute a detailed stress distribution. Calculated cross-section data ... Mehr lesen

Vacancy Electromigration in IC Interconnect Lines

As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... Mehr lesen