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Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a freestanding flexible substrate such as polyimide would distort unacceptably during even minor temperature excursions ...

Computational Analysis of Evaporation in Tailored Microchannel Evaporators

S. Arslan[1], J. Brown[1]
[1]Lawrence Technological University, Southfield, MI, USA

The rapid increase in power densities of integrated circuits has induced a significant interest in new reliable and high heat flux cooling technologies. The implication of such growth is the increased need for more efficient and more compact cooling mechanisms. Promising research has been conducted in the area of MEMS cooling devices, taking advantage of the increased heat transfer ...

Numerical Modeling of Pit Growth in Microstructure

S. Qidwai[1], N. Kota[2], V. DeGiorgi[1]
[1]Naval Research Laboratory, Washington, DC, USA
[2]Science Applications International Corporation, Washington, DC, USA

Pitting corrosion is a complex phenomenon where rates of: i) chemical reactions, ii) diffusion of various species involve in those reactions, and iii) species dissolution at the metal-electrolyte interface are fully dependent on each other, except under special conditions or assumptions. One set of such conditions is that: a) there are no species concentration gradients due to the rapid mixing of ...

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