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Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.

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Bengaluru 2023

Munich 2023

Structural Mechanics and Thermal Stressesx

Thermo-Mechanical Simulation of Dissimilar Titanium Alloys Laser Welding

A. Mathieu [1], L. Weiss [2], E. Fleury [2]
[1] Laboratoire Interdisciplinaire Carnot de Bourgogne (ICB), CNRS-Université de Bourgogne Franche-Comté, Dijon, France
[2] Laboratoire d’Etudes des Microstructures et de Mécanique des Matériaux (LEM3), CNRS- Université de Lorraine, Ile du Saulcy, Metz, France

A 3D thermo-mechanical simulation was developed using COMSOL Multiphysics software in order to predict distortion of a welded dissimilar titanium alloys structure. An angular distortion and a longitudinal shrinkage are predicted in agreement with those obtained experimentally. Mehr lesen

COMSOL Multiphysics® Software for Modeling STW Devices

V. Plessky [1], V. Yantchev [2]
[1] GVR Trade SA, Gorgier, Swizterland
[2] Individual Consultant, Sofia, Bulgaria

Electroacoustic resonators employing surface acoustic waves (SAW) are commercially widely used in RF filters, low noise frequency sources as well as various sensors. In all of these applications the resonance quality factor appears to be a limiting performance factor. Quite often ... Mehr lesen

1D Axisymmetric Modeling of Shrinkage for Non-Porous Materials

J. M. Meot [1], A. Briffaz [1], J. Jacquin [2], S. Rashidi [2]
[1] Cirad, UMR QualiSud, Montpellier, France
[2] Bureau national Interprofessionnel du Pruneau, Villeneuve, France

A 1D-axisymmetric model was built to represent the drying of a single d’Ente plum to d’Agen prune. Underlying assumptions of the model were those of Di Matteo et al. 2003. Sorption isotherms of plum come from Tsami et al, 1990 and equation structure of apparent water diffusion ... Mehr lesen

Toroidal Spring Coil: Displacements & Stress Analysis to Detect the Sealing Parameters

V. Riccardi [1],
[1] Cesare Bonetti, Garbagnate Milanese, Italy

The aim of the simulation is to study the behavior of a particular arrangement of a sealing system made of a Toroidal Spring Coil encapsulated in an thin casing, which is provided with a circumpherential cut to permit the pressure fill it inside. The mechanical simulation implemented ... Mehr lesen

Stress Evolution due to EM in Metal Line Confined: Model and Correlation with Experiments

G. Marti [1], L. Arnaud [2], Y. Wouters [3]
[1] STmicrolectronics & Univ. Grenoble Alpes-SIMAP, France
[2] Cea-Leti Minatec, Grenoble, France
[3] Univ. Grenoble Alpes-SIMAP, Grenoble, France

Electromigration induced failure is one of the main reliability issues for the microelectronics industry. The continuous scaling of the interconnect dimensions leads to higher operating current densities and temperatures, which accentuates the electromigration failure. As a consequence, ... Mehr lesen

Dielectric Adaptive Optical Gels

R. Eisenschmid [1],
[1] OPTIMA pharma GmbH, Schwäbisch Hall, Germany

Adaptive Optics is common sense, since many people use digital cameras with electromechanical iris actors on elastic autofocus lenses. This project tries to create a COMSOL Multiphysics based mathematical model of adaptive optics with electrostatically induced deformation of dielectric ... Mehr lesen

Frequency Analysis of Si-Wafers with Variable Size and Boundary Conditions

E. Gehrig [1],
[1] Hochschule RheinMain, University of Applied Sciences, Wiesbaden Rüsselsheim, Wiesbaden, Germany

Silicon wafers represent key elements in modern microelectronics or photovoltaics. Technological fabrications of wafer sizes with large diameters (e.g. 450 mm) allow an efficient realization for integrated circuits at low cost. However, this material shows a high sensitivity to ... Mehr lesen

Lithic Hypar: New Frontiers in Structural Stone Research

D. Malomo [1], V. Varano [2],
[1] DICEA, University of Rome, Italy
[2] LAMS, University of Rome, Italy

The "Lithic Hypar" research is based on the mechanical analysis of an innovative reinforced stone's structure, architecturally designed by Prof. Fallacara, University of Bari (Italy): the headquarters entrance portal of the French company SNBR (Société Nouvelle Batiment Régional) located ... Mehr lesen

Thermo-Mechanical Analysis and Fatigue Life Prediction for an Electronic Surface-Mount Device (SMD)

G. Petrone [1], C. Barbagallo [1], M. Scionti [1],
[1] BE CAE and Test, Catania, Italy

Electronic devices produce a very high rate of specific heat with respect to their dimensions. Exceeding in maximum safe operating temperature means strong reduction of efficiency, reliability and lifetime. In addition, electronic devices are subjected to periodical thermal loading. ... Mehr lesen

Design of ESS-Bilbao RFQ Linear Accelerator

J. L. Muñoz [1], D. de Cos [1], I. Madariaga [1], I. Bustinduy [1]
[1] ESS-Bilbao, Bilbao, Spain

The design of ESS-Bilbao RFQ (RadioFrequency Quadrupole) linear accelerator cavity using COMSOL Multiphysics is presented. The work includes geometry definition, electrostatics, electromagnetic and thermomechanical coupled simulations. The main part of the work corresponds to the ... Mehr lesen

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