Model ID: 465
Small heating circuits find use in many applications. For example, in manufacturing processes they heat up reactive fluids. The device used consists of an electrically resistive layer deposited on a glass plate. The layer causes Joule heating when a voltage is applied to the circuit. The layer’s properties determine the amount of heat produced.
This multiphysics example simulates the electrical heat generation, the heat transfer, and the mechanical stresses and deformations of a heating circuit device. The model uses the Heat Transfer interface of the Heat Transfer module in combination with the Shell, Conductive Media DC interface from the AC/DC Module and the Solid, Stress-Strain and Shell interfaces from the Structural Mechanics Module.
|The thermally induced von Mises effective stress plotted with the deformation.|