Sep 19, 2019 Albany, New York10:00 AM - 4:00 PM

View All COMSOL Day Locations

You are invited to join us at COMSOL Day Albany for a day of minicourses, panel discussions, and the opportunity to exchange ideas with other simulation specialists in the COMSOL community.

View our event schedule below and register for free today.

Schedule

10:00am
Registration
10:30am

We will demonstrate the process of transforming fully defined models into specialized simulation applications and the various ways of deploying those applications.

11:00am
Coffee Break
11:15am
Parallel Sessions
Nonlinear Structural Mechanics Modeling

Learn about nonlinear structural analysis, including geometric nonlinearity, buckling, contact, and nonlinear structural material models. We will illustrate nonlinear material modeling via example models and demonstrate a nonlinear structural analysis in COMSOL Multiphysics®. We will also discuss best practices for nonlinear structural modeling for application areas such as geometric nonlinearity and contact analysis.

Reacting Flows with Electrochemistry

Are you interested in modeling chemically reacting flows, electroplating, or corrosion? Then attend this session for an overview of the capabilities of the COMSOL Multiphysics® software for modeling reacting flows and electrochemical systems using the add-on Electrochemistry Module and Chemical Reaction Engineering Module. We will also demonstrate how to model an electrochemical system in COMSOL® using these modules.

12:00pm
Break for Lunch
1:00pm

A panel of users from industry and COMSOL will share their experiences with building high-fidelity models to validate, measure, and optimize product designs and to drive corporate decisions. Learn tips and tricks to tackle daily simulation challenges and to build efficient and effective models.

1:45pm
Coffee Break
2:00pm
Parallel Sessions
Modeling Induction Heating with COMSOL Multiphysics®

Induction heating is the combination of low-frequency electromagnetics modeling and heat transfer modeling. In this presentation, we will build a model of an inductive coil that heats up a metallic part. We will also discuss issues related to meshing and solving, as well as options for building both approximate and fully featured thermal models.

Acoustics and Vibrations Analysis in COMSOL Multiphysics®

Learn about the Acoustics Module and how it can be used to model wave propagation in different types of materials, including fluids, solids, porous media, and piezoelectric devices. We will demonstrate how you can use the built-in coupling features to solve an acoustic-structure interaction problem to calculate sound radiation by a vibrating device or determine the transmission of sound through an elastic structure. We will also discuss the aeroacoustics modeling capabilities included in the Acoustics Module.

COMSOL Day Details

Location

Albany Marriott
189 Wolf Road
Albany, New York 12205
Directions

COMSOL Speakers

Yeswanth Rao
COMSOL

Yeswanth Rao is a technical sales manager and has been with COMSOL since early 2008. He holds a PhD in biological engineering and a master's degree in electrical engineering. His finite element background is in MEMS, particularly piezoelectric modeling.

Nithin Jacob
COMSOL

Nithin Jacob joined COMSOL in 2015 and currently works as a technical sales engineer. He received a master's degree in mechanical engineering from Arizona State University and his interests include structural mechanics and product development.

Walter Frei
COMSOL

Walter Frei leads the applications team in COMSOL's Burlington office. He received his PhD in mechanical engineering from the University of Illinois at Urbana-Champaign, working on the optimization of photonic crystal microcavity lasers. He has been with COMSOL since 2008.

Chandan Kumar
COMSOL

Chandan Kumar is an applications engineer specializing in structural mechanics and the analysis and design of microelectromechanical systems. He joined COMSOL in 2009. He earned his PhD from Penn State University, where he studied the dynamics of the self-assembly of semiconductor quantum dots. He is a senior member of IEEE.

Jinlan Huang
COMSOL

Jinlan Huang is an applications engineer for vibrations and acoustics and instructs acoustics and heat transfer training courses. She received her PhD from Boston University, Department of Aerospace and Mechanical Engineering, investigating acoustic wave propagation in complex-tissue environments and ultrasound-induced tissue heating and bleeding control. She joined COMSOL in 2011.

Siva Sashank Tholeti
COMSOL

Siva Sashank Tholeti is an applications engineer at COMSOL. He received his PhD in aeronautics and astronautics from Purdue University. His areas of interest include CFD, plasma-enhanced aerodynamics, plasma physics, propulsion, and multiphysics problems.

Panelists

Trevor Munroe
Naval Nuclear Laboratory
Trevor Munroe started working at Naval Nuclear Laboratory (NNL) in 1981. He graduated from City College of New York with a bachelor's degree in mechanical engineering and from Rensselaer Polytechnic Institute with a master's degree in mechanical engineering. Trevor began his career in system performance analysis but then moved on to new challenges in the nascent field of computational fluid dynamics (CFD), where he worked with in-house and many different commercial CFD codes. He currently works in research and development groups, where he is involved in numerous projects. Trevor has experience in studying and analyzing devices such as heat pipes, thermosiphons, electromagnetic devices, compressors, Stirling engines, and thermoacoustics. Trevor’s experiences led him to appreciate the world of multiphysics. His earliest endeavor into the field of multiphysics involved the arduous task of linking a CFD code with a finite element analysis (FEA) code via a third-party code. He realized the limitations of using a separate code for each physics and soon after transitioned to COMSOL® version 3.4. Trevor has been using COMSOL Multiphysics® for the past decade and has since performed many simulations using COMSOL® software products such as the AC/DC, RF, CFD, Heat Transfer, Chemical Reaction Engineering, Structural Mechanics, Acoustics, Optimization, and Particle Tracing modules. Trevor likes to expand his technical knowledge through websites such as MIT OpenCourseWare and NPTEL.
Michael Vallance
GE Research
Michael Vallance has worked at GE Research during 1983–1988 and 2001–present. He has developed sodium-metal rechargeable batteries, commercialized as Durathon; Cyclics addition-polymerizable polycarbonate; as well as GETEK® high-frequency printed circuit substrate. He is currently developing design tools for BHGE flexible pipe systems, used in deep-sea as well as oil and gas operations, and for ceramic-matrix composite (CMC) components, used on two new turbofan aircraft engines, GE9X and CFM LEAP, which are mounted on the new generation of long-range, wide-body and narrow-body commercial aircraft. _GETEK is a registered trademark of ISOLA USA Corp._
Sri Sri-Jayantha
IBM
Dr. Sri M. Sri-Jayantha received his PhD in mechanical and aerospace engineering from Princeton University in 1983. He then joined IBM Research at Thomas J. Watson Research Center, NY, in 1983 as a research staff member. Currently, he manages a group working on microelectronic and low-temperature system measurement, modeling and simulation. Dr. Sri-Jayantha holds more than 100 U.S. patents and has received 10 Outstanding Technical Achievement (OTA) awards from IBM. His lifetime technical work has involved electric vehicle modeling, aircraft stall dynamics instrumentation, data acquisition and characterization, innovative solutions to track high-density disk drive servo system, and electronic package thermal modeling.

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