You are invited to join us at COMSOL Day Toronto for a day of minicourses, talks by invited speakers, and the opportunity to exchange ideas with other simulation specialists in the COMSOL community.
View the schedule for minicourse topics and presentation details. Register for free today.
Schedule
Learn about the Acoustics Module and how it can be used to model sound waves, their propagation, and their interaction with solids at both small and large scales. Applications include loudspeakers, microphones, sonar, medical devices and more.
Application of FEM and COMSOL® in Electrical Engineering and Power Systems
The author will present how he benefits from using COMSOL Multiphysics® in electrical engineering. The presentation is heavily based on personal experience in underground cables, but other elements of power systems will also be mentioned. The presented examples of the projects utilized FEM to calculate electric fields, magnetic fields, heat transfer, and a combination of those.
Get an overview of the CFD Module and its various capabilities, including turbulent flows, multiphase flows, and particle tracing, with applications ranging from aerospace to the biomedical and pharmaceutical industries.
Get a brief introduction to the capabilities of the Heat Transfer Module, such as modeling the thermal performance of buildings, evaporative cooling, and radiation. Several example models will also be discussed.
Use of the COMSOL Multiphysics® Software to Minimize Physical Experiments: Determining Performance of Building Enclosures
Canada is moving toward more stringent regulations on buildings to reduce the energy consumption and reduce the greenhouse gas (GHG) emission in order to support the ambitious 2030 target of reducing greenhouse gas (GHG) emissions by 40 percent by the federal government. Building envelopes are the main components of buildings that can be enhanced to increase the thermal performance of buildings. In this presentation, we will explain how we use COMSOL Multiphysics® in different aspects of our work, including the following:
- Conducting the thermal analysis on wall assemblies to calculate their thermal performance by using the Heat Transfer Module
- Performing hygrothermal simulations of wall assemblies to understand the effect of actual and future climate loads
- Predicting the deterioration risk of wall components by conducting hygrothermal analysis using heat and moisture transfer in building material and mathematical features in COMSOL Multiphysics®
The multiphysics capability of COMSOL Multiphysics® gives us an option to model other physics associated with the wall assemblies and apply more realistic boundary conditions on the wall assembly in comparison to the dedicated tools for wall assemblies. However, computing time and convergence were found to be the two biggest problems when solving hygrothermal problems.
Attend this session to learn about the capabilities of the COMSOL Multiphysics® software in structural mechanics and related areas. Among other things, we will discuss the newly released Composite Materials Module and the material activation/deactivation feature in the Structural Mechanics Module, which can be used to simulate additive manufacturing and similar processes.
To schedule a 1-on-1 meeting, please contact Ellie at ekulla@comsol.com.
COMSOL Day Details
Location
COMSOL Speakers
COMSOL, Inc.
COMSOL, Inc.
COMSOL, Inc.
COMSOL, Inc.
COMSOL, Inc.
Invited Speakers
Kinectrics Inc.
National Research Council Canada
National Research Council Canada