S_cell 500[um] "Computational cell length"
H_prot 40[um] "Height of protrusion"
W_prot 40[um] "Width of protrusion"
rho 8960[kg/m^3] "Cu density"
M 0.06355[kg/mol] "Cu molar mass"
sigma 5[S/m] "Electrolyte conductivity"
T 293.15[K] Temperature
i0 1e2[A/m^2] "Exchange current density"
alpha_a 1.5 "Symmetry factor"
alpha_c 0.5 "Symmetry factor"
i_avg 5[A/dm^2] "Time-averaged plating current density"
i_rev -50[A/dm^2] "Reverse (dissolution) current density"
t_fwd 0.95 "Forward current duty cycle"
t_rev 1-t_fwd "Reverse current duty cycle"
i_fwd (i_avg-t_rev*i_rev)/t_fwd "Forward (plating) current density"