rhoCu 8900[kg/m^3] Copper density
MCu 68[g/mol] Copper molar mass
Iavg 2[A/dm^2] Average applied current density on cathode
i0 10[A/m^2] Exchange current density
alphaa 1.5 Anodic transfer coefficient
CopperArea 0.4262900321[in^2] Area of copper traces from imported PCB layout
DummyArea 1.1869299746[in^2] Area of dummy pattern
CathodeArea CopperArea+DummyArea Cathode area
Itot Iavg*CathodeArea Total applied current
PlatingThkavg 10[um] Target plating average thickness
PlatingRateavg Iavg/2/F_const*MCu/rhoCu Average plating rate
PlatingTime PlatingThkavg/PlatingRateavg Total plating time