Simulation of a Microrobot, 2D version
Application ID: 111
In this example, one of the legs of a silicon micro robot is modeled in COMSOL Multiphysics.
A technique based on polyimide V-groove joints is used to get each of the legs to move. The polyimide has a relatively high coefficient of thermal expansion, and this causes the leg to bend slightly when the polyimide is heated.
In the COMSOL Multiphysics simulation, a heat transfer model is coupled to a plane strain structural mechanics model in order to study the bending effect.
This application was built using the following: