Die Applications Galerie bietet COMSOL Multiphysics® Tutorial- und Demo-Application-Dateien, die für die Bereiche Elektrik, Struktur, Akustik, Fluid, Wärme und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorialmodell oder die Demo-Application-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
Electrodeposition of a Microconnector Bump with Deforming Geometry in 3D
This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer ... Mehr lesen
Pulse Reverse Plating
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... Mehr lesen
Electroplating of a Printed Circuit Board
This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. Mehr lesen
Electrode Growth Next to an Insulator
This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between the growing electrode and the insulator. Mehr lesen
Fountain Flow Effects on Electrodeposition on a Rotating Wafer
This example extends the analysis made in the model Electrodeposition on a Resistive Patterned Wafer by including the diffusion and convection of copper ions in the electrolyte. The coupled mass transport convection-diffusion effects are of interest in this type of reactor since they ... Mehr lesen
Copper Electroless Deposition
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... Mehr lesen
Alloy Deposition
Electrochemical codeposition is a common low-cost method for producing metal alloys. This tutorial model demonstrates electrodeposition of a nickel (Ni)–phosphorous (P) alloy. The model accounts for charge and mass transport of a multitude of species along with multiple electrode ... Mehr lesen
Electrocoating of a Car Door
This example models electrocoating of paint onto a car door in a time-dependent simulation. The deposited paint is highly resistive which results in lowered local deposition rates for coated areas. A primary current distribution in combination with a film resistance model is used to ... Mehr lesen
Diffusion-Controlled Dendrite Formation Using the Level Set Method
The present model demonstrates diffusion-controlled electrodeposition of copper on microstructured band electrode arrays (MEA). Mass transport by Fickian diffusion of copper ions is solved using the Transport of Diluted Species interface. Dendrite formation as a consequence of diffusion ... Mehr lesen
Bipolar Ion-Exchange Membrane
A bipolar membrane consists of one anion-selective, and one cation-selective membrane, in contact with each other. The combined cation and anion selectivity makes the bipolar membrane highly impermeable to all ions, with the exception of H+ and OH- which are formed by water splitting ... Mehr lesen