Improvement of a Steady State Method of Thermal Interface Material Characterization by Use of a Three Dimensional FEA Simulation in COMSOL

B. Sponagle[1], D. Groulx[1]
[1]Department of Mechanical Engineering, Dalhousie University, Halifax, NS, Canada
Veröffentlicht in 2012

An FEA model of a steady state thermal interface material characterization apparatus was created in COMSOL Multiphysics 4.2a. This model was then fitted using three convection heat loss coefficients and the conductance of the TIM layer to a set of experimental measurements made using a steady state apparatus. It was shown that the model successfully matched the measured temperature values and the TIM conductance determined using the one dimensional assumption in the case which was examined.