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ressidual thermal stress in circular 98nm thickness membrane 3 D

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Dear users


model 1x1mm and 98nm thick polysilicon membrane and 1 mm radius 98nm thick polysilicon circular membrane. And I am trying to check the eigenfrequency differnecies without thermal stress and with thermal stress which varies from 600 C to 20 C (room) temperature + I am evaluating total displacement of membrane with thermal load.

Boundary conditions - fixed all ends of membrane just the top and bottom surfaces are free. Solver solid stress strain.

Does anybody know how the total displacement of membranes should look like in general- since my circular membrane have two asymmetric boubles on up one down and square membrane total displacement looks that the biggest values are in the ends and no deflection in the middle.

+ when evaluating eigenrfrequency differences without and with thermal stress - practical solver gives no difference in eigenvalues- but the theory says different.

Maybe somebody knows where are the problems

Sincerely


0 Replies Last Post 31.03.2011, 06:37 GMT-4
COMSOL Moderator

Hello Karolis Malinauskas

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