Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
Voltammetry is modeled at a microelectrode of 10um radius. In this common analytical electrochemistry technique, the potential at a working electrode is swept up and down and the current is recorded. The current-voltage waveform ("voltammogram") gives information about the reactivity and ... Mehr lesen
This tutorial example models the currents and the concentration of dissolved metal ions in a battery (corrosion cell) made from an orange and two metal nails. This type of battery is commonly used in chemistry lessons. Instead of an orange, lemons or potatoes can also be used. Mehr lesen
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... Mehr lesen
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... Mehr lesen
This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. Mehr lesen
Das vorliegende Modellbeispiel basiert auf dem Modell „Kupferabscheidung in einem Trench“, das in der Electrodeposition Application Library verfügbar ist. Die ungleichmäßige Abscheidung entlang der Trenchoberfläche führt zur Bildung eines Hohlraums. Da das Interface Deformed Geometry ... Mehr lesen
This example models the deposition of an inductor coil in 3D. The geometry includes the extrusion of the deposition pattern into an isolating photoresist mask, and a diffusion layer on top of the photoresist. The mass transfer of copper ions in the electrolyte has a major impact on the ... Mehr lesen
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... Mehr lesen
