Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
This model simulates an LED that emits in the infrared part of the electromagnetic spectrum. The device structure is made up of a single p-n junction formed by a layer of p-type doping near the top surface of an otherwise n-type wafer. This kind of device geometry is simple and cheap to ... Mehr lesen
When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... Mehr lesen
This example was originally formulated by Albert Witarsa under Professor Bruce Finlayson’s supervision at the University of Washington in Seattle. It was part of a graduate course in which the assignment consisted of evaluating the potential of patents in the field of microfluidics ... Mehr lesen
Passive devices can be designed using lumped element features if both the operating frequency of the device and the insertion loss of lumped elements are low. This example simulates two types of lumped element filters that are similar to lumped ports, except that they are strictly ... Mehr lesen
This model shows how to combine different types of material nonlinearity, such as creep and elastoplasticity. In this specific example you will perform a stress and nonlinear strain analysis on a thick cylinder under a nonproportional loading: an initial temperature increase followed by ... Mehr lesen
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... Mehr lesen
Auf Oberflächenplasmonen basierende Schaltungen werden in Anwendungen wie plasmonischen Chips, Lichterzeugung und Nanolithographie eingesetzt. Die App Plasmonisches Gitter berechnet die Koeffizienten der Brechung, der spiegelnden Reflexion und der Beugung erster Ordnung als Funktionen ... Mehr lesen
Marangoni convection occurs when the surface tension of an interface (generally liquid-air) depends on the concentration of a species or on the temperature distribution. In the case of temperature dependence, the Marangoni effect is also called thermo-capillary convection. The Marangoni ... Mehr lesen
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Mehr lesen
Das vorliegende Modellbeispiel basiert auf dem Modell „Kupferabscheidung in einem Trench“, das in der Electrodeposition Application Library verfügbar ist. Die ungleichmäßige Abscheidung entlang der Trenchoberfläche führt zur Bildung eines Hohlraums. Da das Interface Deformed Geometry ... Mehr lesen