Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
Wave heated discharges may be very simple, where a plane wave is guided into a reactor using a waveguide, or very complicated as in the case with ECR (electron cyclotron resonance) reactors. In this example, a wave is launched into reactor and an Argon plasma is created. The wave is ... Mehr lesen
Example of membrane dialysis with a two-layered membrane. A second Reaction Engineering component models a tank connected to the inlet and outlets of the dialysate channel. Mehr lesen
Thermische Energiespeicher werden zur Speicherung von Wärmeenergie aus Solar-, Geothermie- oder Abwärmequellen verwendet. Die einfachsten Anlagen bestehen aus Wassertanks, die häufig in Haushalten zu finden sind und in denen die Sonnenenergie als fühlbare Wärme gespeichert wird. Die ... Mehr lesen
This tutorial shows how to use the Surface-to-Surface Radiation interface to simulate radiative heat transfer with radiation between diffuse emitters and diffuse-and-specular reflectors. This model is separated in two parts. The first part focuses on a validation test for the radiative ... Mehr lesen
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Mehr lesen
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Mehr lesen
In every system where there is conduction of electric current, and where the conductivity of the material is finite, there will be electric heating. Electric heating, also referred to as Joule heating, is in many cases an undesired by-product of current conduction. This model simulates a ... Mehr lesen
This model compares the solution to the model equations of a tubular reactor using Danckwerts inlet and outlet conditions. A second almost identical model is defined with extra inlet and outlet sections where no reactions occur. The concentration at the beginning of the inlet section is ... Mehr lesen
Modeling curing is important in a wide variety of applications such as for devices utilizing polymer materials, rubber materials, plastics, and concrete. Curing is usually an exothermic reaction. In the current example, curing of butyl rubber is studied in a 3D mold for an automotive ... Mehr lesen
A catalyst particle with a hypothetical microstructure is described in detail. The heterogeneous description is approximated in a second model with a homogeneous particle and the results from the two approaches are compared. See: https://www.comsol.se/blogs/modeling-approaches-in ... Mehr lesen