Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... Mehr lesen
A classical flow pattern is the von Kármán vortex street that can form as fluid flows past an object. These vortices may induce vibrations in the object. This problem involves a fluid-structure interaction where the large deformation affect the flow path. The magnitude and the ... Mehr lesen
This tutorial model is kindly provided by Riccardo Vietri, James Ransley and Andrew Spann at Veryst Engineering, LLC. Piezoelectric micropumps are frequently used in medical applications because of their ability to precisely control the metering of very small volumes of fluids or gases. ... Mehr lesen
Micropumps are key components of microfluidic systems with applications ranging from biological fluid handling to microelectronic cooling. This model simulates the mechanism of a valveless micropump, that is designed to be effective at low Reynolds numbers, overcoming hydrodynamic ... Mehr lesen
This models pressure-dependent heating of 4 inch wafer on unipolar electrostatic chuck. Wafer sits on top of ring with electrostatic force holdong down wafer to counter upward pressure from gas flowing in gap between wafer and chuck surface. It is a problem involving 4 coupled physics ... Mehr lesen
In semiconductor manufacturing, vacuum chucks are used to rapidly and contamination-free adsorb and secure wafers before processes such as transfer, lithography, and inspection. Traditional empirical design makes it difficult to quantify the effects of groove shape, size, distribution, ... Mehr lesen
Using a Fluid-Solid Interaction multiphysics interface, the behavior of a spring-loaded ball check valve is studied under varying functional and reverse flow. The fluid force acting on the ball opens the valve at the opening pressure. In the case of a reversed pressure, the ball comes ... Mehr lesen
This model represents a test case of a flow in an elastic tube which is present in several applications. This specific case models viscoelastic flow and represents steady flow in a channel in which part of the upper wall is replaced by an elastic plate subjected to an external pressure. ... Mehr lesen
Squeezed-film gas damping is a critical aspect of many MEMS transducers and actuators. In accelerometers, for example, inertia produces a motion that the device detects. A typical structure connects a large proof mass to surrounding structures with elastic beams, which forms a mechanical ... Mehr lesen
Diaphragm accumulators are essential components that store energy and regulate hydraulic systems. A flexible rubber diaphragm divides the hydraulic fluid from a compressible inert gas, typically nitrogen. These accumulators perform multiple tasks, such as temporarily storing hydraulic ... Mehr lesen
