Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
Dieses Modell analysiert die nichtlineare Transferimpedanz einer sich verjüngenden Öffnung, die Teil einer perforierten oder mikroperforierten Platte (MPP) sein kann. Die Analyse wird für verschiedene Verjüngungsgrade der Perforation und für einen Frequenzbereich durchgeführt. Eine ... Mehr lesen
This tutorial model demonstrates how to compute the impedance of a capacitively coupled plasma. The Time Periodic study computes the time periodic solution of the plasma. Subsequently, the solution is transformed to the time domain, after which the fast Fourier transform (FFT) solver is ... Mehr lesen
The COMSOL® software includes capabilities for 3D plasma modeling. In this example, a square coil is placed on top of a dielectric window and is electrically excited at 13.56 MHz. A plasma is formed in the chamber beneath the dielectric window, which contains argon gas at low ... Mehr lesen
A stationary 3D model of a generic fuel cell cathode describing the mass fraction distribution of oxygen, water, and nitrogen, as well as the current distribution. The model uses Darcy's Law to describe convection, and couples this to Maxwell-Stefan diffusivities to also describe mass ... Mehr lesen
Schottky Contact This benchmark simulates the behavior of an ideal Schottky barrier diode made of a tungsten contact deposited on a silicon wafer. The resulting J-V (current density vs. applied voltage) curve obtained from the model under forward bias is compared with experimental ... Mehr lesen
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... Mehr lesen
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... Mehr lesen
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... Mehr lesen
This model computes the ion energy distribution function (IEDF) for a commercial capacitively coupled plasma reactor. The results show good agreement with experimental data. Mehr lesen
This benchmark model simulates a GaAs nanowire using the self-consistent Schrödinger-Poisson theory to compute the electron density and the confining potential profiles. The predefined Schrödinger-Poisson multiphysics coupling feature is combined with the dedicated Schrödinger-Poisson ... Mehr lesen