Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
This model shows how to model the avalanche breakdown due to the impact ionization in a Silicon Carbide diode. The current-voltage (I-V) characteristics of the device are presented as well as the electric field distribution plot. Furthermore, the carrier generation term has been computed ... Mehr lesen
This model simulates arc welding of a titanium plate made from an alpha-beta titanium alloy. During a weld pass, the material experiences a thermal transient, including both heating and cooling. Phase transformations are modeled, and the evolution of the phase composition over time is ... Mehr lesen
This model illustrates the charge/discharge control of a Lithium-Ion battery in a Simulink® simulation. Mehr lesen
This tutorial demonstrates how to model the band-to-band tunneling across a p–n junction. The tunneling effect is imitated by defining the User-Defined Recombination domain feature which makes the electrons disappear from the conduction band on the n-side and holes disappear from the ... Mehr lesen
This tutorial example is kindly provided by Dr. James Ransley at Veryst Engineering, LLC. This model continues from the base model “A Micromachined Comb-Drive Tuning Fork Rate Gyroscope”, which is also provided by Dr. Ransley. The model demonstrates how to accurately compute the effects ... Mehr lesen
A plane electromagnetic wave is incident on a metallic sphere partially embedded on a substrate. In this electromagnetic scattering problem, the far-field variables are computed for a few elevation angles of incidence. Mehr lesen
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... Mehr lesen
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Mehr lesen
Dieses Beispiel veranschaulicht das Prinzip des nasschemischen Ätzens für 2D-Geometrien unter laminarer Strömung. Ziel dieses Tutorials ist es, zu untersuchen, wie das Kupfersubstratmaterial abgetragen wird und wie sich die Hohlraumform während des Nassätzprozesses entwickelt. Das ... Mehr lesen
This model computes the temperature distribution in a battery pack that is in use at a specified power. The current is controlled in Simulink® to ensure constant power during usage. Mehr lesen