Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
In direct bonding, particulate contamination at the interface can significantly reduce bonding quality. Even micron-scale particles may prevent local contact and lead to large interfacial voids. This model demonstrates a 3D simulation workflow for die-to-wafer (D2W) direct bonding. The ... Mehr lesen
In semiconductor manufacturing, vacuum chucks are used to rapidly and contamination-free adsorb and secure wafers before processes such as transfer, lithography, and inspection. Traditional empirical design makes it difficult to quantify the effects of groove shape, size, distribution, ... Mehr lesen
PCB is fabricated by laminating multiple materials, such as FR-4, copper, and resin, which exhibit significantly different coefficients of thermal expansion (CTE). When subjected to heating, the differential thermal expansion among these layers induces interlaminar deformation mismatch, ... Mehr lesen
This model showcases a nail penetration experiment into a layered battery. The analysis couples solid mechanics, electric currents, and heat transfer to capture the response during penetration. A metallic nail is driven into a sandwiched battery structure composed of two electrodes and a ... Mehr lesen
In this model, the stress concentrations around a superelliptic hole in a thin plate are investigated. To learn more about this model, see our accompanying blog post “Stress Concentrations Around a Superellipse”. Mehr lesen
