Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird
Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.
Sehen Sie sich die Kollektion für die COMSOL Conference 2023 an
Coupling Non-Newtonian Fluid Flow and Heat Transfer Inside a Scraped Surface Heat Exchanger
Scraped-surface heat exchangers (SSHEs) handle products that are viscous, that contain particles, and that tend to deposit on the heat transfer surface. The rotating scraper blades continuously remove any deposition on the heating or cooling surface, thereby maintaining the efficiency of ... Mehr lesen
Photovoltaic Module Design and Mounting for Operation at Elevated Ambient Temperatures
Irradiance is fundamental in the energy production of photovoltaic (PV) modules and models can be developed using just irradiance data. However, module temperature has also significant impact on the power output. In locations with high ambient temperatures PV module performance can be ... Mehr lesen
Laser Assisted Bonding (LADB) Thermal Modeling with COMSOL Multiphysics®
New emerging trends in the MEMS market are linked to the availability of small, reliable and miniature sensors for harsh environment applications to increase penetration in all application fields, considering very wide operating condition ranges. These trends are pushed forward by the ... Mehr lesen
Fluid-Structure Interaction of Coupled Valves in Sucker Rod Pump
Motivation We simulate the fluid driven interaction between two dynamically coupled valves designed to work in conjunction with each other. Such interacting valves are extensively used in sucker rod pumps for oil extraction. These pumps essentially consist of a pair of ball check valves ... Mehr lesen
Numerical Investigation of Micro Droplet Contact Angle Hysteresis on a Heterogeneous Solid Surface: Application to Carbonate
Contact angle hysteresis is an important physical phenomenon, it is an essential parameter in wetting and capillarity, and it plays an important role in many industrial processes, especially in Enhanced Oil recovery (EOR). In this paper, the contact angle hysteresis (CAH) of ... Mehr lesen
Simulation of Bi-Material Nano-Second Laser Ablation
In the field of laser applications, surface treatment is highly studied. Two process categories are commonly used. First processes use very short pulses (femto or pico seconds) known to avoid thermal effects and to have high spatial resolutions. Second processes have higher interaction ... Mehr lesen
Geophysical Fluid Dynamics: Modelling Non-Linearly Viscous Ice-Flow to Obtain Dates of Flow Change
Ice flows because at low stresses it deforms viscously; the viscosity depends upon the stress. The lubrication approximation (LA) states shear stress is proportional to the product of the ice depth and surface slope. At ice divides the slope and shear stress are zero meaning the ... Mehr lesen
High-Resolution CFD Modeling of a Large-Scale Short-Term Thermal Energy Storage Unit
Small-scale short-term thermal energy storage (TES) systems and large-scale seasonal TES systems have been the focus of many research projects. However, large-scale short-term TES units have not been covered in great depth, even though they play an important role by decoupling the heat ... Mehr lesen
Predicting the Fate of Contaminant and Remediating Nano-Particles in a Polluted Aquifer with an Integrated Modeling Approach
The presence of anthropogenic or natural pollutants in groundwater system poses a threat to water resources. Several remediation techniques have been explored and developed to decrease the concentration of contaminants. One such remediation technique, injection of nano-particles in the ... Mehr lesen
Thin Microchip Release From a Carrier Tape: Structural Mechanics and Vacuum Forces
During semiconductor manufacturing, finished silicon microchips need to be released from a carrier tape they stick to by an adhesive. This is done by vacuum forces that (a) hold the chip flat from above and (b) pull the tape off from the chip underside. Sounds simple, but is very tricky ... Mehr lesen