Sehen Sie, wie die Multiphysik-Simulation in verschiedenen Branchen eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
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Chemical reactions conducted under microwave irradiation have high reaction rates and high selectivity, but these reaction rates are not always reproducible. To achieve reproducibility, a solid-state microwave source with an ultra precise oscillator, high power amplifier module (HPA), ... Mehr lesen
High-power couplers working at 350 MHz for particle accelerator cavities are presently under development in the LEHIPA project at BARC. It is important to analyze RF losses on conducting surfaces and resulting thermal profiles. COMSOL Multiphysics® is used to study these coupled RF ... Mehr lesen
For the SAFARI Imaging Spectrometer, part of the SPICA satellite payload, a Calibration Source is under development. Challenges in the design include the low cooling power (few mW) available at cryogenic temperatures. COMSOL Multiphysics® simulations were used extensively in the design ... Mehr lesen
The optimisation of dimensions, materials choice of heaters in annealing furnaces are done with COMSOL Multiphysics® in 2D-axisymetry. Heat losses sources are identified and corrective actions can be taken in function of simulation results. A power saving of more than 50% is achieved ... Mehr lesen
Tecnotion produces linear motors for the high tech automation and semiconductor markets. Orthocyclically wound coils give the best performance because the largest number of windings can be packed into a given volume, as opposed to "wild winding", where the windings fall where they may. ... Mehr lesen
COMSOL Multiphysics® coupled with Solidworks® is employed to design, simulate and fabricate cartridges for a materials printer to accomplish in-situ curing of UV curable ink patterns as they are printed on flexible media for printed electronic circuit manufacturing. The cartridges ... Mehr lesen
This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of ... Mehr lesen
A two dimensional transient analysis of the conjugate optical-thermal fields induced in a multilayer thin film structure by a moving Gaussian laser source is carried out numerically in order to compare back and front laser treatment processes. Thermal and optical nonlinearity is induced ... Mehr lesen
The main purpose of this paper is to develop a proof of concept software that can simulate the geometry of engraved surfaces and can estimate the depth and width of engraved groove and associated laser parameters. For this purpose, COMSOL has been used to simulate the moving laser beam ... Mehr lesen
Multiphysics optimization of thermal-fluid systems is an emerging area of interest with application to the development of high performance cooling technologies for electronic systems. This paper builds on previous work focused on the development of a computational platform for numerical ... Mehr lesen