Sehen Sie, wie die Multiphysik-Simulation in verschiedenen Branchen eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
A successful development of an effective quench detection and protection method for a high temperature superconducting (HTS) coil based on a HTS coated conductor tape lays on a thorough understanding of its slowly propagating, three-dimension (3D) quench behavior. Toward this goal, a 3D ... Mehr lesen
Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Mehr lesen
The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Mehr lesen
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Mehr lesen
Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... Mehr lesen
The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... Mehr lesen
Dynamic measurement of magnetic particles in continuous flow devices is made very difficult by the limitations imposed by the sensors themselves. Thus, certain sensor layouts are restricted to either number sensitive or spatial resolutive measurements of magnetic particles. We ... Mehr lesen
A finite element model is employed to describe the electric potential distribution and electroosmotic flow field inside a wavy cylindrical channel. The model uses coupled Laplace and Poisson-Boltzmann to evaluate the electric potential distribution inside the channel. It also contains ... Mehr lesen
A fundamental understanding of the transport phenomena in microfluidic channels is critical for systematic design and precise control of such miniaturized devices towards the integration and automation of Lab-on- a-chip devices. Electroosmotic flow is widely used to transport and mix ... Mehr lesen
In this paper a finite element method(FEM) study of a surface acoustic wave (SAW)device excited by electrostatic coupling method is performed by using COMSOL Multiphysics. We have modeled a Rayleigh wave type SAW device by choosing YZ Lithium niobate as the substrate. The effect of ... Mehr lesen
