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Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.

Sehen Sie sich die Kollektion für die COMSOL Conference 2023 an

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Bengaluru 2023

Munich 2023

MEMS and Nanotechnologyx

Designing the Actuator for the Next-Generation Astronomical Deformable Mirrors: a Multidisciplinary and Multiphysics Approach

C. Del Vecchio[1], R. Biasi[2] , D. Gallieni[3], and A. Riccardi[1]

[1]INAF-OAA, Fierenze, Italy
[2]Microgate Srl, Bolzano, Italy
[3]ADS International Srl, Valmadrera, Italy

The actuation system of the deformable mirror is one of the crucial components of an Adaptive Optics unit. One possible implementation comprehends a linear force motor and a capacitive sensor providing the feedback measure signal. Choosing a magnetic circuit that makes optimum use of the ... Mehr lesen

Simulation of the Dynamic Behavior of a Droplet on a Structured Surface using the Non-conservative Level Set Method

N. Boufercha, J. Sägebarth, and H. Sandmaier
Universität Stuttgart / IFF-MST, Stuttgart, Germany

The ongoing trend towards miniaturization, higher integration as well as cost efficiency will make it necessary to investigate a new assembly method for micro components. In this paper, a novel method of fluidic-based micro assembly is presented. A self-assembly effect which is caused by ... Mehr lesen

Acoustic-Structure Interaction Simulation of a Differential Phase Sensor

J. H. Lee[1]
[1]Department of Mechanical Engineering, American University of Sharjah, Sharjah, UAE

The idea of application as a hearing device based on a parasitoid fly, Ormia ochracea has been studied extensively recently. This paper addresses another possible application as an underwater directional sensor. In order to study the feasibility of the application, it is necessary to ... Mehr lesen

Simple Finite Element Model of the Topografiner

H. Cabrera[1], D. A. Zanin[1], L. G. De Pietro[1], A. Vindigni[1], U. Ramsperger[1], D. Pescia[1]
[1]Laboratory for Solid State Physics, ETH Zürich, Zürich, Switzerland

In our recent experiments we are revisiting the topografiner technology for the imaging of surface topography with a resolution of a few nanometers. In these new technique called Near-Field Emission Scanning Electron Microscopy (NFESEM), low-energy electrons are emitted from a ... Mehr lesen

Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs

S. Harrison[1], M. Young[1], M. Hayne[1], P. D. Hodgson[1], R. J. Young[1], A. Strittmatter[2], A. Lenz[2], U. W. Pohl[2], D. Bimberg[2]
[1]Department of Physics, Lancaster University, Lancaster, UK
[2]Institut für Festkörperphysik, Berlin, Germany

Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial dimensions, are the focus of much solid-state physics research, offering superior optical and electronic properties over their bulk counterparts. Both two-dimensional (2D) and zero ... Mehr lesen

Finite Element Analysis of Temperature and Viscosity Effects on Resonances in Thin-Film Bulk Acoustic Wave Resonators

G. Rughoobur[1], M. DeMiguel-Ramos[2], L. García-Gancedo[1], M. Clement[2], J. Olivares[2], T. Mirea[2], W. I. Milne[1], E. Iborra[2], A. J. Flewitt[1]
[1]University of Cambridge, Cambridge, UK
[2]Universidad Politécnica de Madrid, Madrid, Spain

The shear mode of film bulk acoustic resonators (FBARs) is preferred to the longitudinal mode owing to its lower acoustic losses in a liquid. However in addition to mass loading, the resonance is also affected by temperature and liquid viscosity. These two parameters can either be sensed ... Mehr lesen

Plasmonics of Nano-Gaps

T. Hutter[1], S. Mahajan[2], S. R. Elliott[1]
[1]University of Cambridge, Cambridge, UK
[2]University of Southampton, Southampton, UK

Plasmons, i.e. the collective oscillations of electrons in a metallic nano-structure, lead to strong light scattering, absorption and an enhancement of the local electromagnetic field. In this work, the local electric-field enhancement in a system of dielectric nanoparticles placed ... Mehr lesen

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have ... Mehr lesen

Air Damping Simulation of MEMS Torsional Paddle

N. Mahmoodi[1], C. J. Anthony[1]
[1]University of Birmingham, Birmingham, UK

Viscous damping has a significant effect on dynamic performance of the resonators operating within fluid. This work is aimed to find the viscous damping for MEMS torsional paddle operating in air. Interaction of moving structure with the fluid requires a complicated and challenging ... Mehr lesen

MEMS Acoustic Pixel

A. Arevalo[1], I. G. Foulds[2]
[1]King Abdullah University of Science and Technology, Thuwal, Saudi Arabia
[2]The University of British Columbia, Vancouver, BC, Canada

A COMSOL Multiphysics® simulation was used to simulate the behavior of a micro-membrane (Acoustic Pixel) to be used as a potential acoustic transducer. The MEMS and Piezoelectric devices interfaces were used to simulate such transducer. A four-cantilever spring configuration is initially ... Mehr lesen

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