Veröffentlichungen und Präsentationen

Schnellsuche

Ressourcen

Whitepaper

Sehen Sie, wie die Multiphysik-Simulation in verschiedenen Branchen eingesetzt wird

Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.

Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an

Suchbegriff:

Numerical Study of Smoldering Combustion of Activated Carbon in Ⅱ Iodine Absorber

T. Liang[1], M. Liu[1], X. Liu[1], Z. Meng[1]
[1]Safety Engineering, Zheng Zhou University, Zheng Zhou, Henan, China

Iodine absorber is a widely used purification equipment for purifying air in a nuclear power plant. In China, the common type is Ⅱ iodine absorber. Impregnated activated carbon is the main absorber within the iodine absorber. Because of the decays exothermic of radioactive iodine, heat ... Mehr lesen

Multiphysics Simulation of Conjugated Heat Transfer and Electrostatic Field on Application of Electrostatic Chucks (ESCs) Using 3D-2D Model Coupling

K. Hsu[1], C. Li[1], J. Yang[1], J. Chen[1], J. Chang[1]
[1]Institute of Applied Mechanics, National Taiwan University, Taipei, Taiwan

There has been considerable interest in the electrostatic chucks (ESCs) in recent years. Wafer cooling by means of gas at the backside of wafers plays an important role in electrostatic chucks and it uses an electrostatic potential to secure the wafer. In this study, the correlation of ... Mehr lesen

COMSOL Multiphysics® Model of a Solar Dryer

E. C. Santos[1], J. H. Sales[1], C. Lima[2]
[1]Universidade Estadual de Santa Cruz, Ilhéus, BA, Brazil
[2]Instituto Federal da Bahia, Irecê, BA, Brazil

This paper compares the efficiency of a vertical solar dryer vis-à-vis the traditional drying method by the means of a computer simulation. The said program considers geometric, thermal and mechanical effects so as to simulate heat transfer via conduction, convection and radiation. We ... Mehr lesen

Multiphysics Study into Compression Rings, Coated Against Uncoated

M. Dickinson[1,2], N. Renevier [1], J. Calderbank[2,3]
[1]The Jost Institute, School of Computing, Engineering & Physical Sciences, University of Central Lancashire, Preston, UK
[2]Racing to Research Team, School of Computing, Engineering & Physical Sciences, University of Central Lancashire, Preston, UK
[3]School of Computing, Engineering & Physical Sciences, University of Central Lancashire, Preston, UK

Internal combustion engine components have been a main research interest over many decades. The structural mechanics and dynamics of the piston rings has been a large focus of work in order to gain a greater understanding of the how the piston ring dynamics affect the piston ring. ... Mehr lesen

Microwave Heating Simulation of Frozen Pie

F. Chen[1], T. Gulati[1], H. Zhu[1], A. K. Datta[1]
[1]Cornell University, Ithaca, NY, USA

This research studies the thermal effect of frozen pie heating in the microwave oven. Considering as composite material, the properties of pie derived based on its composition. Here the package, susceptor’s influence to the temperature distribution is also studied. Mehr lesen

Embedded Microfluidic/Thermoelectric Generation System for Self-Cooling of Electronic Devices

R. Kiflemariam[1], H. Fekramandi[1], C. Lin[1]
[1]Department of Mechanical & Materials Engineering, Florida International University, Miami, FL, USA

A 3D electro-conjugate heat transfer model was made to study an embedded microfluidic/TEG system (μF/TEG) system. An innovative embedded microfluidic/TEG system (μF/TEG) system is proposed which enables a device to be able to provide power to its cooling system eliminating external power ... Mehr lesen

Study & Modeling of 'Acoustic Matching Layers' for Ultrasound Imaging Probes Through Pulse-Echo FEM Simulation

L. Spicci[1]
[1]Esaote SpA, Florence, Italy

Ultrasound Imaging probes are specific devices that require a very detailed design of acoustic impedance match for the stack of layers that form the probe head (1,3). These are typically made of silicone rubber, special epoxy resins, polyurethanes and, of course, piezoelectric ... Mehr lesen

Modeling the Effect of Headspace Steam on Microwave Heating of Mashed Potato

J. Chen[1], K. Pitchai[1], D. Jones[1], J. Subbiah[1]
[1]University of Nebraska-Lincoln, Lincoln, NE, USA

Introduction: Domestic microwave ovens are widely used to heat food products, because of rapid and convenient heating. Nonuniform heating is the biggest issue in microwave heating process, which also causes food quality and safety issues. Microwave heating models are promising tools to ... Mehr lesen

Modeling of Packed Bed Reactors: Hydrogen Production by the Steam Reforming of Methane and Glycerol

A. Dixon[1], B. MacDonald[1], A. Olm[1]
[1]Department of Chemical Engineering, Worcester Polytechnic Institute, Worcester, MA, USA

The conventional route to hydrogen production is by steam reforming of methane (MSR) in a multitubular packed bed. With the increasing use of biodiesel as a renewable fuel, interest has grown in steam reforming of the excess glycerol produced as a side product (GSR). We use COMSOL ... Mehr lesen

Modeling of Directional Dependence in Nanowire Flow Sensor

A. Piyadasa[1,3], P. Gao[1,2,3]
[1]Department of Physics, University of Connecticut, Storrs, CT, USA
[2]Department of Materials Science & Engineering, University of Connecticut, Storrs, CT, USA
[3]Institute of Materials Sciences, University of Connecticut, Storrs, CT, USA

3D finite element analysis model has been constructed for testing the directional dependence in a novel form of nanowire array gas flow sensor. Single nanowire (p-type single crystal Silicon) model is developed using fluid structure interaction and piezoresistivity components in the MEMS ... Mehr lesen

Erste

981–990 of 1029

Letzte