Sehen Sie, wie die Multiphysik-Simulation weltweit in der Forschung eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
Sehen Sie sich die Sammlung für die COMSOL Conference 2026 an
Blade-tip clearance and turbine inlet temperature are critical efficiency parameters in turbomachinery design. Smaller clearances reduce leakage losses, but increase the risk of rubs between blades and the casing. Higher operating temperatures improve efficiency, but reduce the finite ... Mehr lesen
Additive Friction Stir Deposition (AFSD) is a solid-state additive manufacturing process capable of producing structural repairs with mechanical properties approaching those of wrought material, making it particularly attractive for restoring damaged aerospace components such as those ... Mehr lesen
We study energy distributions in unmodulated metal-dielectric-metal (MDM) structures. Two modes are observed: cavity mode and gap plasmon mode. The electric and magnetic fields behave differently in these modes. In the gap plasmon mode, electric energy is strongly confined in the ... Mehr lesen
Electrical dispersal deterrents are the most mature technology for deterring invasive species in open waterways. However, they pose human safety risks, incur high operational costs, and exhibit reduced efficacy against smaller fish. Consequently, current research focuses on optimally ... Mehr lesen
Capillary filling—the autonomous wicking of liquids through hydrophilic microchannels driven by surface tension and wettability—enables pump-free fluid handling in microfluidic devices for point-of-care diagnostics, lab-on-a-chip systems, and biomedical applications. A critical design ... Mehr lesen
The transition to glass-core PCB substrates is driven largely by electrical advantages — low dielectric loss, CTE match to silicon. The glass substrate itself is a substantially better thermal conductor compared to FR-4 epoxy (kglass ≈ 1.4 W/m·K vs. kFR4 ≈ 0.3 W/m·K), producing broader ... Mehr lesen
Compacted bentonite is widely investigated as an engineered buffer material for deep geological disposal systems because of its low hydraulic conductivity, swelling capacity, and self-sealing behavior. Under elevated temperatures, unsaturated bentonite buffers may undergo coupled thermo ... Mehr lesen
Stuck-pipe events remain among the costliest failure modes in drilling operations, contributing roughly one quarter of non-productive time and producing major financial losses across the oil and gas industry. Once the pipe becomes stuck, recovery is governed by a simple but decisive ... Mehr lesen
