Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird
Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
The scaling down of Copper interconnects is an effective approach to increasing the number of signal I/O lines and performance in advanced fine-pitch packaging. However, as dimensions are reduced, the risk of electromigration-induced failures in the copper interconnects becomes ... Mehr lesen
Nowadays, designing ever more efficient power modules requires complex materials and more innovative methodologies. To significantly reduce the lead time of the devices and decrease the costs, especially during the prototyping and the testing phases, a Finite Element Analysis (FEA) can ... Mehr lesen
This work, which is done in the framework of the SisAl Pilot EU project, presents the use of the COMSOL Multiphysics® software for simulating ladle furnace preheating. The SisAl Pilot project aims at optimising the silicon production in Europe by recycling materials and using a carbon ... Mehr lesen
The growing adoption of electric vehicles has led to increased exposure of cars to stray magnetic fields. To address this issue, inductive position sensors have emerged as a viable solution due to their inherent immunity to stray magnetic fields. Widespread adoption of the inductive ... Mehr lesen
The paper describes how the fluxgate current sensor works and how it is built in the COMSOL Multiphysics® software. Four COMSOL® modules were used: -AC/DC Module: the magnetic field physic is used in order to apply the Ampere-Maxwell’s law to the different sensor components and to the ... Mehr lesen
Process Hardware for heating, etching and plasma deposition in vacuum processes on Silicon wafers or glass substrates face challenging requirements due to very shallow and extended structures. Molecular Flow calculations are used to evaluate staggered shields with the aim to protect ... Mehr lesen
NDIR (Non-dispersive infrared) sensors are state of the art for measuring gas concentrations in the Mid-infrared spectrum, e.g. components of exhaled human breath. These sensors require fitting light sources. Micro light bulbs and other filament based light source are sensible to ... Mehr lesen
Simulation of laser processes are more and more efficient. In some cases, as welding and additive manufacturing, the physical phenomena are complex, multi-physics and multi-phases, thus some assumptions have to be done. For Laser Powder Bed Fusion, a laser beam melts and vaporizes the ... Mehr lesen
The thermal load on the system components is one of the technical problems in the development of microfocus X-ray tubes. To improve their stability in long-term use, it is important to understand the physical phenomena and their influence on the system stability and filament lifetime. To ... Mehr lesen
Baking is a central production step in the industrial production of edible wafers and waffles. The initially liquid batter is heated with a pair of metallic baking plates. Establishing a uniform and accurate temperature at the baking face (inner baking plate surface) is crucial for ... Mehr lesen