Sehen Sie, wie die Multiphysik-Simulation in verschiedenen Branchen eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
The AC losses that superconducting magnet systems experience during transient events are an important design consideration in fusion reactors. We present results on the approach for calculating AC losses in the high temperature superconducting (HTS) toroidal field (TF) magnets of the ... Mehr lesen
The thermo-hydraulically coupled code COMSOL-VIPER (Kröhn and Fromme 2023) based on the balance equations of the experimental VIPER code (Kröhn 2011) for simulating water uptake by bentonite has been further advanced. Bentonite is of particular interest as a geotechnical barrier against ... Mehr lesen
Plasmonic metallic nanostructures have been demonstrated an effective way to enhance the light emission efficiency in LEDs. Here, we propose a design of white LEDs that combining dielectric silicon nanopillar array in the color-converting layer. By investigating theoretically the guided ... Mehr lesen
The versatility of COMSOL Multiphysics® software has positioned it at competitive levels against other considered industrial-standard engineering software tools. This contribution is directed towards emphasizing the need of further developing the basic concepts of this versatile tool in ... Mehr lesen
Dr. Chin-Hsien Cheng received his PhD. Degree in National Tsing-Hua University, Taiwan in 2007. He joined Institute for Integrated Energy Systems, University of Victoria, Canada as a post-doctoral fellow until Aug. 2009. Currently, he is a research associate and lab manager of the ... Mehr lesen
Using modeling software such as COMSOL Multiphysics during the design phase, an approach called “simulation-led design”, allows ideas to be both inspired and validated by the use of simulations. Then, using simulations after the product is designed can shorten the prototype-testing ... Mehr lesen
As the light output of the LED is strongly dependent on the thermal performance, thermal interface material (TIM) has become an area of interest that can be used to sink more heat out to the ambient. In COMSOL Multiphysics, physics interfaces like joule heating, heat transfer in solid ... Mehr lesen
Accurate tissue mechanical properties are essential for simulating medical devices that deform skin under suction, such as devices for the treatment of fat, skin wounds, and vascular skin conditions. While suction-based methods exist for estimating these properties, most rely on small ... Mehr lesen
An experimental LED light composed of a multi-chip LED-module, a LED driver and an efficient heat sink, was investigated using COMSOL Multiphysics software and the Heat Transfer Module. In an LED light heat is mainly generated in the LEDs but some amount of heat is generated also in the ... Mehr lesen
The semiconductor and IC package manufacturer are continuously seeking for miniaturization devices to fix into a small space. An unfortunate miniaturization of devices will have an effect on heat dissipation density, which leads to low rate of heat dissipation to the ambient. As a ... Mehr lesen