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Suchbegriff:

Deformation of Stamp Features with Slanted Walls During Microcontact Printing

F. E. Hizir[1], H. M. Al-Qahtani[1, 2], D. E. Hardt[1]
[1]Massachusetts Institute of Technology, Cambridge, MA, USA
[2]King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia

Microcontact printing is a method for depositing patterns of thin films or molecular monolayers on surfaces using a polydimethylsiloxane (PDMS) stamp for selective mechanical contact (Figure 1). Undesired deformation of the stamp features during printing affects printed pattern quality. ... Mehr lesen

Simulation of Droplet Impingement on a Solid Surface by the Level Set Method

J. Hu[1], R. Jia[1], K. Wan[2], X. Xiong[3]
[1]Department of Mechanical Engineering, University of Bridgeport, Bridgeport, CT, USA
[2]Mechanical and Industrial Engineering, Northeastern University, Boston, MA, USA
[3]Department of Electrical Engineering, University of Bridgeport, Bridgeport, CT, USA

The dynamic behavior of droplet impingement on a solid surface is important to many engineering applications. This paper studied the dynamic behavior of a droplet impinging onto solid dry surfaces with different surface wettability using the COMSOL Multiphysics® software. The simulation ... Mehr lesen

Modeling Internal Heating of Optoelectronic Devices Using COMSOL

N. Brunner[1][,][2]
[1]Voxtel, Inc, Beaverton, OR, USA
[2]University of Oregon, Eugene, OR, USA

In this paper the heat transfer module in COMSOL is utilized to simulate internal heating of an Avalanche Photodiode due to light-induced current through a resistivity that depends on charge carrier concentrations in the device. Initial tests are done by modeling the heating process on a ... Mehr lesen

Heat and Mass Transfer in Reactive Multilayer Systems (RMS)

M. Rühl[1], G. Dietrich[2], E. Pflug[1], S. Braun[2], A. Leson[2]
[1]TU Dresden, Laser and Surface Technology, Dresden, Germany
[2]IWS Dresden, Fraunhofer Institute for Material and Beam Technology, Dresden, Germany

Established joining techniques like welding, soldering or brazing typically are characterized by a large amount of heat load of the components. Especially in the case of heat sensitive structures like MEMS this often results in stress induced deformation and degradation or even damaging ... Mehr lesen

Pseudo-3D Multiphysics Simulation of a Hydride Vapor Phase Epitaxy Reactor

M. Hackert-Oschätzchen[1], M. Penzel[1], P. Plänitz[2], A. Schubert[1][3]
[1]Chemnitz University of Technology, Chemnitz, Germany
[2]GWT-TUD, Dresden, Germany
[3]Fraunhofer Institute for Machine Tools and Forming Technology IWU, Chemnitz, Germany

Gallium nitride (GaN) and its related nitride alloys with special physical properties are in technical areas of high interest. The growing of gallium nitride boules on non-native sapphire or silicon carbide requires complicated mechanisms of defect reduction in the lattice structure. ... Mehr lesen

Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a ... Mehr lesen

Demonstration of All-Optical NAND Logic Gate Using Photonic Integrated Circuits

J. T. Andrews[1], R. Choubey[1], O P Choudhary[1], N. Malviya[1], A. Patel[1], M. Kumar[1], S. Chouksey[1], J. Solanki[1]
[1]National MEMS Design Center, Department of Applied Physics, Shri G S Institute of Technology & Science, Indore 452003 MP, India

A logic gate performs a certain Boolean logic operation on one or more logical inputs and produces a single logical output. The logic values are either “true” or “false.” Logic gates are bistable devices, that is, they may yield one of these two possible stable outputs. The NAND logic is ... Mehr lesen

Numerical Prediction of Weld Bead Geometry in Plasma Arc Welding of Titanium Sheets

V. Dhinakaran[1], S. Khope[1], N. S. Shanmugam[1] , K. Sankaranarayanasamy[1]
[1]National Institute of Technology, Tiruchirappalli, Tiruchirappalli, Tamil Nadu, India

Plasma Arc Welding (PAW) is one of the important arc welding processes commonly used in electronics, medical, automotive and aerospace industries due its high accuracy, finishing, and ability of welding any hard materials. It is an extension of Tungsten Inert Gas welding (TIG or GTAW). ... Mehr lesen

Engineering Light Photonics, Plasmonics and Meta-materials

Dr. A. Prabhakar
Dept. of Electrical Engineering, IIT-Madras, Chennai, Tamil Nadu, India

Anil Prabhakar joined the faculty at IIT-Madras in 2002, after 5 years of post-doctoral experience in the hard disk drive industry. His current research interests include photonics, spintronics, nonlinear dynamics and alternative and augmentative communication. As a member of the Optics ... Mehr lesen

COMSOL Multiphysics in Plasmonics and Metamaterials

S. Sun [1,2], and G. Guo [2,3]
[1]Physics Division, National Center for Theoretical Sciences (North), National Taiwan University, Taipei 10617, Taiwan
[2]Department of Physics, National Taiwan University, Taipei 10617, Taiwan
[3]Graduate Institute of Applied Physics, National Chengchi University, Taipei 11605, Taiwan

This paper will present research about: * Effective-medium properties of metamaterials: A quasi-mode theory * 2D complete band gaps from 1D photonic crystal * Optical microcavities Mehr lesen

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