Electroplating of a Printed Circuit Board

Application ID: 20331


This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath.

Dieses Beispiel veranschaulicht Anwendungen diesen Typs, die mit den folgenden Produkten erstellt wurden: