Improving Thermal Management of Electronic Devices with COMSOL Multiphysics® - Archived
The use of modeling and simulation in the electronics industry is highly effective for designing efficient thermal management solutions, enabling users to virtually test different operating conditions and gain valuable insights that would otherwise be too difficult, expensive, and time-consuming to achieve with physical experiments and prototypes.
The COMSOL Multiphysics® software and its add-on modules offer a wide range of features for modeling heat transfer by conduction, convection and radiation, as well as electromagnetic modeling functionality. The software's built-in multiphysics capabilities make it possible to create high-fidelity simulation models that account for electromagnetic and thermal interactions in order to test the efficiency of different component designs and cooling technologies.
In this archived webinar, we will demonstrate how to build models and simulation applications using COMSOL Multiphysics® and highlight some heat transfer modeling features using examples relevant to the thermal management of electronic components. We will also provide an overview of the platform’s capabilities for multiphysics modeling, with a focus on couplings involving heat transfer phenomena.
Register for Improving Thermal Management of Electronic Devices with COMSOL Multiphysics®
To register for the event, please create a new account or log into your existing account. You will need a COMSOL Access account to attend Improving Thermal Management of Electronic Devices with COMSOL Multiphysics®.
For registration questions or more information contact info-in@comsol.com.
Archived Webinar Details
This is a recording of a webinar that originally aired on April 15, 2026
