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heat flux coefficient setting in Thermal Microactuator model

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Hello, I have a question in Thermal Microactuator model. (www.comsol.com/showroom/documentation/model/8493/).

Is there a specific reason to set Heat transfer coefficient, upper surface (htc_us) to 0.04[W/(m*K)]/100[um]. Where is this 100 um from? it is something like boundary layer thickness?


Can we set htc_us the same as htc_s, or closer, since it is also close to the ground substrate?



Could you offer some reference on how to set heat flux or convection cooling coefficient for microactuators?



thanks.




0 Replies Last Post 01.11.2012, 00:39 GMT-4
COMSOL Moderator

Hello Andy Zhang

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