Die Applications Galerie bietet COMSOL Multiphysics® Tutorial- und Demo-Application-Dateien, die für die Bereiche Elektrik, Struktur, Akustik, Fluid, Wärme und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorialmodell oder die Demo-Application-Datei und die dazugehörigen Anleitungen herunterladen.

Suchen Sie über die Schnellsuche nach Tutorials und Applications, die für Ihr Fachgebiet relevant sind. Um die MPH-Dateien herunterzuladen, melden Sie sich an oder erstellen Sie einen COMSOL Access Account, der mit einer gültigen COMSOL-Lizenz verknüpft ist. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.

Heat Transfer Modulex

Optimization of a Heat Exchanger with Turbulent Flow

Commercial heat exchangers often feature a complex design. It is significantly easier to build a design with new CAD parameters than to build designs with novel topologies. This model demonstrate how to optimize the size and position of the tubes in a tube and shell heat exchanger. It is ... Mehr lesen

Heat Sink

This model is intended as a first introduction to simulations of fluid flow and conjugate heat transfer. It shows you how to: Draw an air box around a device in order to model convective cooling in this box, set a total heat flux on a boundary using automatic area computation, and ... Mehr lesen

Evaporative Cooling of Water

This tutorial shows how to couple three physics interfaces to model evaporative cooling. The effects that need to be taken into account are heat transfer, transport of water vapor, and fluid flow. The Wet Surface feature is used to implement the source term for the water vapor and to ... Mehr lesen

Heating Circuit

Small heating circuits find use in many applications. For example, in manufacturing processes, they heat up reactive fluids. The device in this tutorial example consists of an electrically resistive layer deposited on a glass plate. The layer results in Joule heating when a voltage is ... Mehr lesen

Evaporation in Porous Media with Large Evaporation Rates

Evaporation in porous media is an important process in the food and paper industries, among others. Many physical effects must be considered: fluid flow, heat transfer, and transport of participating fluids and gases. All of these effects are strongly coupled and predefined interfaces ... Mehr lesen

Free Convection in a Water Glass

This model treats the free convection and heat transfer of a glass of cold water heated to room temperature. Initially, the glass and the water are at 5 °C and are then put on a table in a room at 25 °C. The nonisothermal flow is coupled to heat transfer using the Heat Transfer module. Mehr lesen

Free Convection in a Light Bulb

This model treats the free convection of argon gas within a light bulb. It shows the coupling of heat transport (conduction, radiation and convection) to momentum transport (non-isothermal flow) induced by density variations caused by temperature. COMSOL Multiphysics model makes it ... Mehr lesen

Natural Convection Cooling of a Vacuum Flask

The following example solves a pure conduction and a free-convection problem in which a vacuum flask holding hot coffee dissipates thermal energy. The main interest is to calculate the flask's cooling power; that is, how much heat it loses per unit time. This tutorial model treats the ... Mehr lesen

Shell-and-Tube Heat Exchanger

Shell-and-tube heat exchangers are commonly used in oil refineries and other large chemical processes. In this model, two separated fluids at different temperatures flow through the heat exchanger, one through the tubes (tube side) and the other through the shell around the tubes (shell ... Mehr lesen

Electronic Chip Cooling

This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... Mehr lesen

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