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Composite Thermal Barrier

This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin thermally resistive layer boundary condition is used to avoid resolving the thin domains. The technique is useful when modeling heat transfer through thermal barriers like multilayer coatings.

Disk-Stack Heat Sink

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such ...

Flat Heat Pipe

Heat pipes are used in a wide range of applications for efficient cooling, for example in microelectronic systems, computer internals, and for large cooling devices in spacecraft industry. It combines the principles of heat conduction and phase change to get extremely efficient heat transfer between a cold and hot side. This model shows the basic set-up for modelling the heat transfer ...

Thermoelectric Leg

A thermoelectric leg is a fundamental component of a thermoelectric cooler (or heater). For example, a thermocouple is a thermoelectric module typically made of two thermoelectric legs: one made of p-type and of one n-type semiconductor material which are connected in series electrically and in parallel thermally.

Finned Pipe

Finned pipes are used for coolers, heaters, or heat exchangers to increase heat transfer. They come in different sizes and designs depending on the application and requirements. When the fins are placed outside the pipe, they increase the heat exchange surface of the pipe so that a cooling or heating external fluid can exchange heat more efficiently. When placed inside the pipe, it is the inner ...

Optimizing a Thermal Process

A thermal processing scenario is modeled whereby two heaters raise the temperature of a gas flowing through a channel. The Optimization Module is used to find the heater power to maximize the outflow temperature, while maintaining a constraint on the peak temperature at the heaters themselves.

Heat Conduction in a Finite Slab

This simple example covers the heating of a finite slab and how the temperature varies with time. We will set up the problem in COMSOL Multiphysics after which we compare the solution to the analytical solution.

Marangoni Effect

Marangoni convection occurs when the surface tension of an interface (generally liquid-air) depends on the concentration of a species or on the temperature distribution. In the case of temperature dependence, the Marangoni effect is also called thermo-capillary convection. The Marangoni effect is of primary importance in the fields of welding, crystal growth and electron beam melting of ...

Rapid Thermal Annealing

In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon as the wafer reaches this temperature, it is held there for a few seconds and then finally quenched. An ...

Radiative Cooling of a Glass Plate

When producing glass, the glass melt is cooled down through radiation to form the final shape, subjecting it to stresses. Numerical treatment of radiative heat transfer, using the Radiative Transfer Equation (RTE), helps to optimize this process. COMSOL Multiphysics provides three discretization methods for modeling radiation in participating media and solving the RTE: the Rosseland ...