Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. Mehr lesen
The mutual inductance and induced currents between a single turn primary and twenty turn secondary coil in a concentric coplanar arrangement is computed using a frequency domain model. The secondary coil is modeled using a homogenized approach which does not explicitly consider each turn ... Mehr lesen
Breaker and disconnector devices are widely used in AC substations in power systems.In this model, the Electrostatics Interface is used to simulate the electric potential and electric field in a 110kV 3-phase high-voltage switchgear operating at 50 Hz. A surrogate model is also trained ... Mehr lesen
This model shows how to build and solve a radiative heat transfer problem using the Heat Transfer interface. In particular, this 2D model illustrates the use of the surface-to-surface radiation feature. In this model, three surfaces form a cavity. Heat flux is set at two outer ... Mehr lesen
Trusses are commonly used to create light structures that can support heavy loads. When designing such a structure, it is important to ensure its safety. For a tower made of bars, buckling can cause the structure to collapse. This model shows how to compute the critical buckling load ... Mehr lesen
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Mehr lesen
An ion-sensitive field-effect transistor (ISFET) is constructed by replacing the gate contact of a MOSFET with an electrolyte of interest. The concentration of a specific ionic species in the electrolyte can be determined by measuring the change in the gate voltage due to the interaction ... Mehr lesen
This tutorial shows how to model a miniaturized magnetostrictive antenna developed for use inside living cells. The stress in the antenna, the magnetic flux density, the current density, and the displacement of the tip of the device are investigated at the resonance frequency. Mehr lesen
This model exemplifies how the rate of steel corrosion in an oil platform increases over time due to build-up of a resistive film on the sacrificial anodes, formed by reaction products. The model also includes secondary current distribution electrode kinetics on the protected steel ... Mehr lesen
Anti-reflective coatings are frequently used in optical systems to reduce the amount of stray light produced when a beam of light crosses from one medium into another medium with a different refractive index. The simplest example of an anti-reflective coating is a quarter-wavelength ... Mehr lesen
