Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
Dieses Beispiel zeigt eine stationäre 2D-Thermoanalyse mit Konvektion bei einer vorgegebenen Außentemperatur (Umgebungstemperatur). Es wird als Benchmark-Beispiel angegeben. Das Benchmark-Ergebnis für den Zielort ist eine Temperatur von 18,25 °C. Das COMSOL Multiphysics Modell, das ein ... Mehr lesen
A steel billet is quenched in oil from its austenitic state. A 2D axisymmetric model is used to simulate the coupled problem of austenite decomposition, heat transfer, and solid mechanics. During the quenching process, the austenite decomposes into a combination of ferrite, pearlite, ... Mehr lesen
Surface micromachined thin films are often subject to residual stress. This COMSOL Multiphysics example describes a thin film resonator with straight or folded cantilever beam springs. The resonance frequencies of the resonator are affected by thermal stress. Using folded springs ... Mehr lesen
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... Mehr lesen
This example demonstrates how to use temperature dependent materials within the Nonlinear Structural Materials Module. A large container holds pressurized hot water. Several pipes are attached to the pressure vessel. Those pipes can rapidly transfer cold water in case of an emergency ... Mehr lesen
This model is a benchmark model for the Slip Flow interface. It is based on both analytic and numeric calculations. Air at atmospheric pressure flows through a conducting micro-channel connecting two reservoirs maintained at different temperatures. A flow between the two reservoirs ... Mehr lesen
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Mehr lesen
Carbon deposition on the surface of solid catalysts is commonly observed in hydrocarbon processing. A known problem is that carbon deposits can impede the activity of catalysts as well as block the flow of gas through a catalyst bed. This example investigates the thermal decomposition ... Mehr lesen
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Mehr lesen
This model is an introduction to defining and verifying a satellite orbit, and computing the solar, albedo, and Earth infrared thermal loads. A 1U CubeSat is in a circular orbit at 400km altitude, inclination of 50°, and longitude of ascending node of 0°. The satellite is rotating slowly ... Mehr lesen