Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
The purpose of this app is to understand EIS, Nyquist, and Bode plots. The app lets you vary the bulk concentration, diffusion coefficient, exchange current density, double layer capacitance, and the maximum and minimum frequency. Electrochemical impedance spectroscopy (EIS) is a common ... Mehr lesen
Highly alloyed stainless steel used in chlorinated seawater systems may be prone to corrosion under certain operating conditions. Conventional cathodic protection technique is less suitable for stainless steel due to unacceptable anode consumption rate and propensity to hydrogen ... Mehr lesen
This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... Mehr lesen
This example shows how to perform a fatigue analysis of a structure subjected to random vibrations. Times to failure using the cycle counting models according to Bendat and Dirlik are compared. Mehr lesen
Silicon micromechanical resonators have long been used for designing sensors and are now becoming increasingly important as oscillators in the consumer electronics market. In this series of models, a surface micromachined MEMS resonator, designed as part of a micromechanical filter, is ... Mehr lesen
An electrostatically actuated MEMS resonator is simulated in the time and frequency domains. The device is driven by an AC + DC bias voltage applied across a parallel plate capacitor. The dependence of the resonant frequency on DC bias is assessed, and frequency domain and pull-in ... Mehr lesen
Through-silicon vias (TSVs) allow chips or wafers to be connected vertically, making TSV a crucial technology for 2.5D and 3D packaging. The basic structure of a TSV consists of a deep hole penetrating a silicon substrate, a filling metal (usually copper) in the deep hole, and an ... Mehr lesen
This model shows that the frequency response, i.e., admittance curve, of the SAW unit cell with IDT is in good agreement with the series resonance & antiresonance frequencies obtained from the eigenfrequency studies in the tutorial Surface Acoustic Wave Velocity Calculations from a ... Mehr lesen
