Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
In this example, phase transformation data and phase material properties are imported from JMatPro, and used to compute CCT curves. Dilatometry curves (axial thermal strain) are computed across a range of cooling rates. Mehr lesen
A 3D model is used to simulate the cooling of a bevel gear from an austenitic state. Phase material properties and phase transformation data are imported into the model. The final phase composition and the residual stress state are computed. Phenomena such as thermal strains, phase ... Mehr lesen
This model analyzes the operation of a micromirror in air and the effects of thermoviscous damping on the vibration response. The model includes thermal losses in the structure as well as thermoviscous acoustic phenomena. The model couples the Thermoelasticity multiphysics interface to ... Mehr lesen
This model serves the purpose of validation and verification of the Linear Elastic Material, Layered model in the Shell interface. In COMSOL Multiphysics, composites are analyzed either based on Layerwise 3D elasticity theory through the Layered Shell interface or based on FSDT-ESL ... Mehr lesen
This model demonstrates how to set up a phase field damage multiphysics model to predict crack propagation in thermoelastic solids under large deformations. The crack-driving force depends on the principal stresses, which in turn depend on the temperature distribution in the solid ... Mehr lesen
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Mehr lesen
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... Mehr lesen
This model demonstrates an integrated structural-thermal-optical performance (STOP) analysis of an optical system. The Petzval Lens tutoral is used as the basis for this model, together with a simple barrel geometry The isothermal model performs a Parametric Sweep over several uniform ... Mehr lesen
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Mehr lesen
Das folgende Beispiel löst ein reines Konduktions- und ein freies Konvektionsproblem, bei dem eine Thermoskanne mit heißem Kaffee Wärmeenergie abgibt. Das Hauptinteresse besteht darin, die Kühlleistung der Thermoskanne zu berechnen, d.h. wie viel Wärme sie pro Zeiteinheit verliert. In ... Mehr lesen