Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
These models use the Discrete Ordinates method (DOM) and P1 approximation to solve a 3D radiative transfer problem in an emitting, absorbing, and linear-anisotropic scattering finite cylindrical medium. Using the S6 quadrature of DOM leads to accurate results, which are needed in ... Mehr lesen
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... Mehr lesen
The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... Mehr lesen
Dieses Modell simuliert ein Temperaturprofil in einer Reihe von Zellen und Kühlrippen in einem flüssigkeitsgekühlten Akkupack. Das Modell wird in 3D und für einen Betriebspunkt während eines Ladezyklus gelöst. Ein vollständiges elektrochemisches 1D-Modell für den Lithium-Akku berechnet ... Mehr lesen
In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon ... Mehr lesen
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Mehr lesen
This is a model of an RF waveguide bend with a dielectric block inside. There are electromagnetic losses in the block as well as on the waveguide walls which cause the assembly to heat up over time. The material properties of the block are functions of temperature. The transient thermal ... Mehr lesen
This model illustrates how to implement a multiphysics contact. It models the thermal and electrical behavior of two contacting parts of a switch. The electrical current and the heat flow from one part to the other only through the contact surface. The contact switch device has a ... Mehr lesen
This example demonstrates how to use temperature dependent materials within the Nonlinear Structural Materials Module. A large container holds pressurized hot water. Several pipes are attached to the pressure vessel. Those pipes can rapidly transfer cold water in case of an emergency ... Mehr lesen
This example simulates the thermodynamical evolution of moist air in an electronic box with the aim of detecting whether condensation occurs when the external environment properties change. The model imports measured data for the air temperature, pressure, and water vapor concentration. ... Mehr lesen