Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
In many structural dynamics applications, some components are stiff compared to the supporting structure. Such a stiff part will only contribute to the dynamic properties of the structure through its mass and moment of inertia. It is then possible to reduce the model size significantly ... Mehr lesen
Die Ausbreitung elastischer Wellen im Boden nach einem seismischen Ereignis wird mithilfe eines 2D-Modells simuliert. Der Einfluss der Topologie der Bodenoberfläche auf die Wellenausbreitung wird veranschaulicht, indem ein idealer Halbraum durch das Vorhandensein eines kleinen Berges ... Mehr lesen
A contactor wedge is subject to a gravity load and is forced to slide due to a boundary load over a rigid target wedge surface, both infinitely wide. Horizontal linear springs are also connected between the left vertical boundary and the ground. This is a large sliding problem including ... Mehr lesen
A fuel cell stack operates at temperatures just below 100 °C, which means that it has to be heated at start-up. The fuel cell stack consists of unit cell of anode, membrane, and cathode connected in series through bipolar plates. This study presents a model that couples the thermal and ... Mehr lesen
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... Mehr lesen
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Mehr lesen
The eigenfrequencies of a rotating blade are studied in this benchmark. It shows how stress stiffening and the combined effect from stress stiffening and spin softening affects the fundamental eigenfrequency. High rotational speed in rotating machineries can result in centrifugal forces ... Mehr lesen
The External Material functionality makes it possible to program your own material models for cases when the built-in material models are not sufficient. For structural mechanics, you have the possibility to either completely define the material model in a domain, or to add an inelastic ... Mehr lesen
The model studied is a benchmark for a hinged cylindrical panel subjected to a point load at its center. A linear buckling analysis predicts the critical buckling load. Such an analysis will however not give any information about what happens at loads higher than the critical load. ... Mehr lesen
This is a benchmark model involving stick-slip friction of a ring rolling inside another ring. The displacement of the inner ring is computed and compared to the analytical result. This model also shows how to tackle friction dominated contact problem. Mehr lesen
