Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Mehr lesen
For slender structures, buckling is a catastrophic instability if the service load is above the critical limit. For such structures, it can be important to study the behavior of the structure beyond the critical buckling load, which is known as postbuckling analysis. Tracing the ... Mehr lesen
This is a benchmark model involving stick-slip friction of a ring rolling inside another ring. The displacement of the inner ring is computed and compared to the analytical result. This model also shows how to tackle friction dominated contact problem. Mehr lesen
An acoustic point source emits a pressure wave in water that travels toward a piece of glass. Cracks are formed and propagate due to high tensile stresses developed in the glass. A fully coupled acoustic-structure interaction problem including phase field damage in solids is solved in ... Mehr lesen
This model illustrates how to perform prestressed eigenfrequency and frequency response analyses in a contact problem. A circular plate is squeezed between two thicker plates. The peak of the prestressed frequency response analysis is compared with the prestressed eigenfrequencies as ... Mehr lesen
The four-point bending test is a conventional test method used to test the mechanical properties of materials subjected to bending. It is a reliability test used for semiconductor packaging and assembly. This model demonstrates the stress analysis of an IGBT module subjected to a four ... Mehr lesen
Interference fit is a technique used to join or fit one part over or around another part. The internal part is cooled, so that it shrinks, and is then fitted. Once the part heats up again and expands, a contact pressure builds up at the interface between the two parts. This type of ... Mehr lesen
This model studies the natural frequencies of a pre-tensioned string using the 2D Wire interface. This is an example of “stress stiffening”; in fact the transverse stiffness of wire elements is directly proportional to the tensile force. Strings made of piano wire have an extremely high ... Mehr lesen
This example studies the deformation of a hemispherical shell, where the loads cause significant geometric nonlinearity. The maximum deflections are more than two magnitudes larger than the thickness of the shell. The problem is a standard benchmark, used for testing shell formulations ... Mehr lesen
Dieses Modell zeigt eine vollständige vibroakustische Analyse eines Lautsprechers einschließlich Treiber, Gehäuse und Ständer. Sie können eine nominale Antriebsspannung anlegen und den resultierenden Schalldruckpegel im Gehäuse und im Außenraum sowie die Verformung des Gehäuses und des ... Mehr lesen