Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
Interfacial failure by delamination or debonding can be simulated with a Cohesive Zone Model (CZM). This example shows the implementation of a CZM with a bilinear traction-separation law. It is used to predict the mixed-mode softening onset and delamination propagation in a composite ... Mehr lesen
This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... Mehr lesen
This model shows how to use the scattered field formulation to compute the transmission coefficient for impinging P and S plane elastic waves onto a finite size phononic crystal. The transmission tends to zero in the frequency range corresponding to P- and S-wave band gaps, as ... Mehr lesen
This is a tutorial example, showing how to work with pretensioned bolts. Various aspects of bolt modeling are explored: Modeling bolts as solids or by beams Connections of beams to solid components Bolts ended by nuts or by internal threads in the attached component Import of bolt and ... Mehr lesen
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Mehr lesen
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... Mehr lesen
This example explores the shift in natural frequencies caused by changing the temperature. One study investigates a doubly clamped beam where both ends are fixed, while the other study looks at a cantilever beam where only one end is fixed. The following effects are studied: Stress ... Mehr lesen
In his example, the lowest natural frequency of a 3D bracket are maximized using shape optimization. Mehr lesen
Solid-state batteries (SSB) are a promising technology that could suffer from internal mechanical stresses due to the growth and shrinkage of the electrodes within all-solid components. With this model, the charge-discharge cycling of an SSB is simulated with a focus on the interaction ... Mehr lesen
In diesem Beispiel einer peristaltischen Pumpe quetschen Walzen einen flexiblen Schlauch zusammen und die Kompression befördert ein Fluid durch den Schlauch. Das Modell zeigt, wie Sie das Interface Fluid-Structure Interaction verwenden können. Der Hauptvorteil einer peristaltischen ... Mehr lesen
