Die Application Gallery bietet COMSOL Multiphysics® Tutorial- und Demo-App-Dateien, die für die Bereiche Elektromagnetik, Strukturmechanik, Akustik, Strömung, Wärmetransport und Chemie relevant sind. Sie können diese Beispiele als Ausgangspunkt für Ihre eigene Simulationsarbeit verwenden, indem Sie das Tutorial-Modell oder die Demo-App-Datei und die dazugehörigen Anleitungen herunterladen.
Suchen Sie über die Schnellsuche nach Tutorials und Apps, die für Ihr Fachgebiet relevant sind. Beachten Sie, dass viele der hier vorgestellten Beispiele auch über die Application Libraries zugänglich sind, die in die COMSOL Multiphysics® Software integriert und über das Menü File verfügbar sind.
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... Mehr lesen
Fatigue testing of nonlinear materials with creep mechanism is a time-consuming process. In accelerated life testing the experiment time is greatly reduced by subjecting the material to testing conditions in excess of the operating one. In the model an aggressive thermal load cycle is ... Mehr lesen
This example investigates the electrical performance of a cascaded cavity filter operating in the millimeter-wave 5G band with temperature changes. The thermal variations result in structural deformations of the structure. Thus, the resonant frequencies of the filter elements (cavities) ... Mehr lesen
In this example, a random vibration test of electronic equipment is simulated. Three analyses are performed, one for acceleration in each global direction. Accelerations in the components and forces in clamping bolts are evaluated. Mehr lesen
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... Mehr lesen
Electronic equipment often has to be certified to function after having been subjected to a specified shock load. In this example, the effect of an 50g 11ms half sine shock on a circuit board is investigated using response spectrum analysis. The results are compared with a time domain ... Mehr lesen