Veröffentlichungen und Präsentationen

Light emitting Diode (LED) has been proved to be the best resource for commercial as well as industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (Rth) and rise in junction temperature (TJ) are notable parameters. Heat dissipation in the LED has been partly achieved with the evolution of efficient heat sinks. This paper deals with the design of heat sink with innovative advective extended surfaces which contributes for the multi-dimensional heat dissipation. Also simulation of heat distribution over the proposed substrate design proved the influence of the design and material removal from the heat sink. It is suggested that the new design will help to reduce the junction temperature considerably thus enhancing the performance of LEDs.