COMSOL Conference 2025 Proceedings
Vom Program Committee akzeptierte Sammlung von Beiträgen, Postern und Präsentationen
Auf der COMSOL Conference 2025 stellten Ingenieure, Forscher und Wissenschaftler aus aller Welt ihre Nutzung von Modellierung und Simulation in allen wichtigen Branchen und im akademischen Bereich vor. Verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach Thema oder Veranstaltungsort. ISBN: 978-1-7364524-3-1
Introduction Computer simulations are widely used for the interpretation and inversion of electromagnetic measurements in well logging. Until recently, simulated logs have been computed with approximate 1D or 2D models. By using the COMSOL® RF Module installed on a cluster, we show that ... Mehr lesen
In this paper, the mechanism of charging process was simulated and analyzed. The simulation was conducted using COMSOL Multiphysics® software, based on the laminar two-phase flow level-set interface coupling with the electrostatic interface. Meanwhile, different parameters (such as the ... Mehr lesen
It is a complex problem to calculate the photonic crystal fiber model, and the methods of plane wave expansion, Hermite-Guasssian function and beam propagation have been analyzed. Finally the multipole method is adopted for solving problem. The hexagonal air holes in cladding have been ... Mehr lesen
扬声器的失真问题一直受电声业界的关注，尤其是谐波失真，它是影响扬声器重放声音音质的主要因素之一。 本文提出了一种基于 COMSOL Multiphysics® 软件预测扬声器谐波失真的仿真分析方法。该方法需建立包括磁场、振动系统和声场等多个物理场的扬声器的全模型，给扬声器加载一单频电压信号，用瞬态分析的方法可求解得到该频率激励下的扬声器的多个重要物理量随时间的变化函数，如流经音圈的电流I(t)、音圈的受力F(t)、振动系统表面上任意点的位移x(t)，以及声场中任意点的声压P(t)等。给扬声器加载一个时间长度为0.1s的单频电压信号，仿真分析所得的防尘帽顶点的位移曲线 ... Mehr lesen
Plasma Arc Welding (PAW) is one of the important arc welding processes commonly used in electronics, medical, automotive and aerospace industries due its high accuracy, finishing, and ability of welding any hard materials. It is an extension of Tungsten Inert Gas welding (TIG or GTAW). ... Mehr lesen
There has been considerable interest in the electrostatic chucks (ESCs) in recent years. Wafer cooling by means of gas at the backside of wafers plays an important role in electrostatic chucks and it uses an electrostatic potential to secure the wafer. In this study, the correlation of ... Mehr lesen
As embalagens de produtos alimentícios são hoje em dia predominantemente feitas com cartão tipo LPB (Liquid Packaging Board) e usualmente estocadas de forma empilhada, tanto nas prateleiras como nos depósitos dos supermercados. O LPB é um compósito multicamadas de construção complexa, ... Mehr lesen
Evaporative coolers are viable alternative to air conditioners because of their low power consumption. However, in tropical humid environments the increased humidity that accompanies the cool air in the evaporative coolers causes an uncomfortable wet feeling, since it hinders the ... Mehr lesen
Electropolishing is an electrochemical process that radiofrequency accelerating cavities undergo in order to improve their inner metal surface finishing. This is performed prior to their installation into particle accelerators, in order to enhance their accelerating properties. Using ... Mehr lesen
This paper presents a numerical analysis of magnetic devices, dipole, quadrupole and undulator and a THz Free Electron Laser (FEL) electron-beam recovery system. Free Electron Laser are an important source of coherent radiation being used in the study of chemical properties of ... Mehr lesen