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Auf der COMSOL Conference 2025 stellten Ingenieure, Forscher und Wissenschaftler aus aller Welt ihre Nutzung von Modellierung und Simulation in allen wichtigen Branchen und im akademischen Bereich vor. Verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach Thema oder Veranstaltungsort. ISBN: 978-1-7364524-3-1

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2018 - All

Numerical Prototyping of Locally Heated Digital Microfluidic Devices

C. Ozen [1], G. Sathyanarayanan [1], S. Cito [2], T. Sikanen [1],
[1] Faculty of Pharmacy, Drug Research Programme, University of Helsinki, Helsinki, Finland
[2] Department of Mechanical Engineering, Rovira i Virgili University, Tarragona, Spain

An alternative approach to integration of a local heat source with the digital microfluidic (DMF) platform by attaching inkjet-printed silver microheaters to the bottom plate was recently introduced (Sathyanarayanan et al., MNE 2017). This approach allows more degrees of freedom to the ... Mehr lesen

Iterative Electric Potential Adjustment of Damaged Naval Vessels Using the Onboard ICCP-System

C. Thiel [1], K. Neumann [1], C. Broecheler [1], F. Ludwar [2], A. Rennings [1], J. Doose [2], D. Erni [1],
[1] General and Theoretical Electrical Engineering (ATE), University of Duisburg-Essen, and CENIDE – Center for Nanointegration Duisburg-Essen, Duisburg, Germany
[2] Technical Center for Ships and Naval Weapons, Naval Technology and Research (WTD 71), Eckernförde, Germany

Naval vessels involuntary communicate with their surrounding environment via different signatures, which can be separated in acoustic, electric, magnetic, seismic and pressure signatures. The electric signature, also known as Underwater Electric Potential (UEP)-Signature is mainly caused ... Mehr lesen

Reducing Loudspeaker Systems Panel Vibrations

D. Cinanni [1],
[1] ASK Industries Spa, subject to direction and coordination of JVCKENWOOD Corporation, Italy

One of the main design questions in loudspeaker enclosures concern vibrations reduction. An ideal cabinet would be infinitely rigid, so a section of an engineer work is focused on this goal. Solutions depend by loudspeaker system audio field: Line Arrays, Automotive environments or hi ... Mehr lesen

Numerical Optimization of Active Heat Sinks Considering Restrictions of Selective Laser Melting

F. Lange [1], C. Hein [1], C. Emmelmann [1],
[1] Fraunhofer Institution for Additive Production Technologies IAPT, Hamburg, Germany

Parametric and topology optimization approaches are widely used techniques for performance improvement of components in terms of various objectives. Especially topology optimization often leads to complex geometries that are difficult or impossible to produce by conventional ... Mehr lesen

Simulation of an Electrically Heated Carbon Fibre Fabric

L. Fromme [1], H. Funke [1], J. Stückemann [1], P. Tschöke [1],
[1] Bielefeld University of Applied Sciences, Faculty of Engineering and Mathematics, Bielefeld, Germany

For an increasing portion of various construction components carbon fibre reinforced plastic is used, since this material combines desirable properties as high stability and low weight. Carbon fibre reinforced plastic consists of carbon fibre fabric which is drenched in resin that then ... Mehr lesen

Empirical Verification of COMSOL® - Simulation of Resonance Frequency of an Archimedean Spiral Coil

M. P. Adams [1], K. P. Koch [1],
[1] Hochschule Trier, Trier, Rhineland Palatinate, Germany

An simple analytical model for the calculation of the resonance frequency of coils typical consists of a network of inductance, capacitance and resistance. Calculating these three parameters based on spatial geometry is not easy in most cases. The finite element method as used in COMSOL ... Mehr lesen

COMSOL Multiphysics® Models as the Design Guidance in the Selected Transport Phenomena Problems

S. Spotar [1],
[1] Nazarbayev University, Astana, Kazakhstan

This paper demonstrates experience of using the COMSOL Multiphysics® transport phenomena models in design practice, particularly at the early stage of design when there is might be too many possible design suggestions relying on the shell balance equations, and engineering intuition. ... Mehr lesen

3D-Printed Microfluidic Chip System for Dielectrophoretic Manipulation of Colloids

I. Kuehne [1], N. Philippin [1], M. Michatz [2], A. Frey [2],
[1] Heilbronn University of Applied Science, Kuenzelsau, Germany
[2] University of Applied Science, Augsburg, Germany

INTRODUCTION: Microfluidics, as a crucial technology of recent years, enables numerous applications for Point-of-Care-Testing such as Lab-on-Chip-Systems (LOC) or Micro-Total-Analysis-Systems (µTAS) and is exceptionally well-suited for cell sorting or DNA trapping. Especially the ... Mehr lesen

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COMSOL Conference 2025 Proceedings

Vom Program Committee akzeptierte Sammlung von Beiträgen, Postern und Präsentationen