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Paper und Präsentationen der COMSOL Conference 2023
Auf der COMSOL Conference 2023 präsentierten Wissenschaftler und Ingenieure aus aller Welt ihre multiphysikalischen Simulationsprojekte. Erfahren Sie, wie Forscher in Ihrer Branche derzeit numerische Modellierung einsetzen, um Designs zu optimieren, Prozesse zu rationalisieren und Produkte zu verbessern, indem Sie in den folgenden technischen Publikationen und Vorträgen stöbern. Verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich oder Konferenzort.
ISBN: 978-1-7364524-1-7
Towards Data Driven Design of Flow Blurring Atomizer
Liquid atomization relies on a variety of forces that disturb the surface of the liquid. In the case of flow-blurring (FB) atomization, turbulent structures are induced within the liquid channel to achieve this effect. It is known that the transition from the conventional flow-focusing ... Mehr lesen
Two-Scale Modeling Of The WAAM Process: Link Between Thermo-Hydrodynamics And Mechanics
Simulation of arc-wire additive manufacturing is under development in many academic and industrial sectors and at different scales. The study at the melt pool scale is often interesting to study deposition shapes and defects but not very relevant to calculate the stresses and strains at ... Mehr lesen
Uncertainty Quantification and Propagation in Multiphysics Modeling of the PVT Growth of SiC Crystal
The wide bandgap semiconductor silicon carbide (SiC) has drawn increasing attention in recent years as a promising material for high-power, high-frequency, and high-temperature operating devices. These outstanding properties of SiC make it a good candidate to replace silicon in many ... Mehr lesen
Unleash Power Within: Finite Element Modeling of Temporal Interference Stimulation of Phrenic Nerves
Introduction: Mechanical ventilation in the ICU can result in complications, including ventilator-induced diaphragmatic dysfunction (VIDD), leading to extended hospital stays and increased costs. This abstract presents a novel approach using multiple esophageal electrodes for phrenic ... Mehr lesen
Using COMSOL® in a Connected Virtual Factory -Thermal RSM for Rapid Adaptable Packaging Line
A tablet blister cavity is thermally modelled using the Shell interface in COMSOL® and a response surface created to connect to other simulations such as process flow/cost models to form a surrogate model. This virtually represents a pharmaceutical tablet packaging line, that is ... Mehr lesen
Using of General Extrusion Operator in Heat Transfer Applications
In this paper, the COMSOL Certified Consultant BE CAE & Test shows as the general extrusion operators can be successfully used to simulate thermal transfers in an industrial rotating furnace. Heat transfer in translating and rotating furnaces is a topic of high interest in several ... Mehr lesen
Utilizing COMSOL® in a Workflow to Asses Stroke Risks in a Large Set of Patient’s Carotid Arteries
In the medical field the risk assessment of strokes caused by pathological irregularities in the carotid artery bifurcation area plays a great role for the best patient’s treatment decision.The stroke risk evaluation by physicians traditionally incorporates evaluation of the stenosis ... Mehr lesen
Visualization of a Noise Barrier for Educational Purposes Using a COMSOL App
The COMSOL® app library of the Technical University of Munich is a collection of applications for simulating acoustic phenomena. They are used in the teaching of acoustics to visually represent fundamental vibrational aspects and provide learners with a visual understanding. In the ... Mehr lesen
Which Hardware to Choose for the Optimal Simulation with COMSOL®
Besides the accuracy of the results, the required computation time is an important factor for simulations in general. Thus, the question arises, that is also discussed in many blog posts, which computer properties influence the computation time. Here, we present findings from a ... Mehr lesen
Wire Bonding: A Thorough Numerical Methodology
The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the development of Computer Aided Engineering (CAE) modeling of processes. Robust Chip-Package Interaction requires a deep understanding of thermo-mechanical stresses imposed during the ... Mehr lesen