Sehen Sie, wie die Multiphysik-Simulation in verschiedenen Branchen eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
Geothermal energy systems require precise sizing to ensure efficiency and sustainability, particularly for probe fields and groundwater doublets. We present two specialized applications developed using COMSOL Multiphysics’ Application Builder, leveraging the Heat Transfer and Groundwater ... Mehr lesen
Thermocouples are widely used in industry for process temperature measurement. Calibration drift is a well-known problem which adversely affects process control, particularly in harsh environments (e.g. high temperature). To overcome this, a mechanism for self-calibration of ... Mehr lesen
In the field of pasta drying, where accurate prediction of temperature and moisture content distribution is critical, the use of modeling and simulation plays a key role. This study aims to assess operational conditions that ensure the production of safe, high-quality pasta. An advanced ... Mehr lesen
Bitumen and asphalt durability is a critical concern in pavement engineering, particularly in the context of sustainability and carbon footprint reduction. Accurate prediction of the lifespan of these materials is essential for life cycle assessment (LCA) from cradle to grave. However, ... Mehr lesen
This work presents a comprehensive modeling and validation study of MEMS-based infrared (IR) emitter chips using a neural network-assisted inverse modeling approach in COMSOL Multiphysics. Starting from a single baseline chip geometry, a simulation model was developed that captures the ... Mehr lesen
The transfer molding process is a widely used method for encapsulating microelectronics and power semiconductor devices. In power electronics, it is gaining increasing importance, particularly in the automotive sector [1]. In transfer molding, an epoxy mold compound (EMC) is injected ... Mehr lesen
With the Creation, roll-out, and maintenance of COMSOL Simulation apps, the role of simulation engineers and departments is expanding to include responsibilities similar to those of software developers. Within our department, we have undergone this transformation and will share the key ... Mehr lesen
The reversible storage of hydrogen in metal hydrides represents an attractive technology for hydrogen-based energy systems. In addition to their application as pure hydrogen storage media, metal hydrides can also be used to develop thermochemical hydrogen compressors, which can be ... Mehr lesen
