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Sehen Sie, wie die Multiphysik-Simulation in Forschung und Entwicklung eingesetzt wird

Ingenieure, Forscher und Wissenschaftler aus allen Branchen nutzen die Multiphysik-Simulation, um innovative Produktdesigns und -prozesse zu erforschen und zu entwickeln. Lassen Sie sich von Fachbeiträgen und Vorträgen inspirieren, die sie auf der COMSOL Conference präsentiert haben. Durchsuchen Sie die untenstehende Auswahl, verwenden Sie die Schnellsuche, um eine bestimmte Präsentation zu finden, oder filtern Sie nach einem bestimmten Anwendungsbereich.

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Heat Transfer and Phase Change

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Heat Propagation Improvement in YBCO-Coated Conductors for Superconducting Fault Current Limiters

D. M. Djokic[1], L. Antognazza[1], M. Abplanalp[2], M. Decroux[1]
[1]DPMC, University of Geneva, Geneva, Switzerland
[2]ABB Corporate Research Centre, Dättwil, Switzerland

YBCO Coated Conductors (CCs), used for applications in Resistive Superconducting Fault Current Limiters (RSFCLs), are known to have insufficiently high Normal Zone Propagation Velocity (NZPV) during quench events. The improvement can be made by enhancing the thermal conductivity of YBCO ... Mehr lesen

Modeling and Design of Material Inkjet Printer Ultraviolet LED Curing Cartridges Using COMSOL Multiphysics® for Printed Electronics Applications

M. Guvench[1], R. Wiswell[1]
[1]University of Southern Maine, Gorham, ME, USA

COMSOL Multiphysics® coupled with Solidworks® is employed to design, simulate and fabricate cartridges for a materials printer to accomplish in-situ curing of UV curable ink patterns as they are printed on flexible media for printed electronic circuit manufacturing. The cartridges ... Mehr lesen

The Influence of Channel Aspect Ratio on Performance of Optimized Thermal-Fluid Structures

E.M. Dede
Toyota Research Institute of North America, Ann Arbor, MI, USA

Multiphysics optimization of thermal-fluid systems is an emerging area of interest with application to the development of high performance cooling technologies for electronic systems. This paper builds on previous work focused on the development of a computational platform for numerical ... Mehr lesen

Thermal Simulations of a LED Light Using COMSOL Multiphysics

M. Maaspuro[1]
[1]University of Turku, Turku, FInland

An experimental LED light composed of a multi-chip LED-module, a LED driver and an efficient heat sink, was investigated using COMSOL Multiphysics software and the Heat Transfer Module. In an LED light heat is mainly generated in the LEDs but some amount of heat is generated also in the ... Mehr lesen

Active Infrared Technique for Landmine Detection: Numerical and Experimental Results

P. Fallavollita[1,2], S. Esposito[1,2], and M. Balsi[1,2]
[1]Dipartimento di Ingegneria dell’Informazione, Elettronica e Telecomunicazioni, “La Sapienza” University, Rome, Italy
[2]Humanitarian Demining Laboratory, Cisterna di Latina, Italy

Landmines are an open problem in many countries of the world. They cause injuriesand death and no technique proposed to date guarantees fast and 100% reliable detection alone. To this purpose, at the Humanitarian Demining Laboratory of “La Sapienza” University of Rome, several solutions ... Mehr lesen

Thermal Model for Single Discharge EDM Process Using COMSOL Multiphysics

K. Gajjar[1], U. Maradia[2], K. Wegener[2]
[1]Indian Institute of Technology Bombay, Mumbai, Maharshtra, India
[2]Institute for Process Tools and Manufacturing (IWF), Zurich, Switzerland

Electrical Discharge Machining (EDM) is a non-conventional process used for machining electrically conducting materials. In die sink-EDM, sparks are generated between tool and workpiece resulting in heating of both electrode surfaces and creating a melt pool of metal which leads to ... Mehr lesen

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