Sehen Sie, wie die Multiphysik-Simulation in verschiedenen Branchen eingesetzt wird
Multiphysik-Modellierung und -Simulation treiben Innovationen in Industrie und Wissenschaft voran – wie die zahlreichen Anwendungsbeispiele zeigen, die jedes Jahr in den Fachbeiträgen und Postern von Ingenieuren, Forschern und Wissenschaftlern auf der COMSOL Conference vorgestellt werden. Lassen Sie sich von den unten aufgeführten aktuellen Beiträgen inspirieren oder nutzen Sie die Schnellsuche, um eine bestimmte Präsentation zu finden oder nach Anwendungsbereich oder Konferenzjahr/-ort zu filtern.
Sehen Sie sich die Kollektion für die COMSOL Conference 2024 an
Wire Electric Discharge Machining (WEDM) is widely used technique for machining intricate geometries. It is a spark erosion, non contact machining process and this gives it an advantage in machining metals irrespective of their hardness [1]. Main process parameters of WEDM are peak ... Mehr lesen
Active Infrared Thermography (IRT) is a family of non-destructive testing (NDT) techniques used for the detection of surface and buried defects in a wide range of materials. The method is robust and sensitive enough to be used even in harsh industrial environments However, the ... Mehr lesen
A technological revolution of Point-Of-Care (POC) devices is becoming essential, especially infectious diseases diagnosis for vulnerable population, it can be achieved by upgrading the Lab on Card device. In this device, the reaction is conducted by an Eppendorf tube as a biological ... Mehr lesen
Development of micro-pumps will allow the minimization of many mechanical, bio-engineered and electrical systems, for example: controlled drug delivery systems or liquid cooled microprocessors. The development of such system is facing two major challenges: the design of actuation ... Mehr lesen
This paper assesses the capability and sensitivity of COMSOL Multiphysics® to evaluate phase-changing material suitability for Thermal Energy Storage. The simulated system is a packed bed of encapsulated spheres, containing phase changing materials (PCM), placed inside a single ... Mehr lesen
This abstract describes a COMSOL® App that has been created to perform thermal simulations of an electronics assembly. The assembly comprises fourteen components including a photonic integrated circuit (PIC), a printed circuit board assembly (PCBA), a thermoelectric cooling (TEC) Peltier ... Mehr lesen
Environmental factors such as temperature and humidity can significantly affect the quality of the metal powder used in power bed fusion additive manufacturing, leading to variations in the integrity of finished components. It is therefore important to monitor and minimize the exposure ... Mehr lesen
Additive manufacturing processes are increasingly used for designing metallic parts with complex geometries. The current needs are focused on the manufacturing of large-scale parts, typically of meter range. However, for such dimensions, the traditional trial-and-error methodology used ... Mehr lesen
